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College of Engineering(공과대학)School of Mechanical and Aerospace Engineering(기계항공공학부)Dept. of Mechanical Engineering(기계공학과)ME-Conference Papers(학술회의논문)

In-situ moiré measurement of adhesive flip-chip bonded assembly under thermal cycling condition

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Ham, SJ / Kwon, WS / Paik, Kyung-Wookresearcher / Lee, Soon-Bokresearcher
Publisher
IEEE
Issue Date
2002-06
Language
English
Citation

2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, pp.63 - 67

URI
http://hdl.handle.net/10203/129004
Appears in Collection
MS-Conference Papers(학술회의논문)ME-Conference Papers(학술회의논문)
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