MS-Conference Papers(학술회의논문)
- Browse
- Issue Date Author Title Subject Type
Recent Items
-
1
Machine Learning based Flexible Piezoelectric sensor
Lee, Keon Jae, Acoustics 2023, 2023-12-06
-
2
Electric modulation of magnon spin transport in yttrium iron garnet thin films
Takayuki Shiino; Kim, Geunwoo; Phuock, Cao Van; Jeong, Jong-Ryul; Park, Byong-Guk, The 13th International Conference on Advanced Materials and Devices (ICAMD2023), 2023-12-05
-
3
Orbital Hall torques and magnetization switching of perpendicular magnetization
Shin, Soyoung; Lee, Soogil; Park, Byong-Guk, The 13th International Conference on Advanced Materials and Devices (ICAMD2023), 2023-12-05
-
4
Fast field-free spin-orbit torque switching in magnetic multilayer
Koh, Daekyu; Park, Byong-Guk, The 13th International Conference on Advanced Materials and Devices (ICAMD2023), 2023-12-05
-
5
Ultrafast spin dynamics of non-collinear antiferromagnet Mn3Sn driven by an optical spin-orbit torque
Lee, Won-Bin; Park, Byong-Guk; Lee, Kyung-Jin; Choi, Gyung-Min, The 13th International Conference on Advanced Materials and Devices (ICAMD2023), 2023-12-04
-
6
Magnetic dynamics by exchange bias in the NiFe/IrMn double layers
Pi, Jinju; Seo, Seongbin; Park, Jungmin; Kim, Geunwoo; Park, Byong-Guk; Kim, Sanghoon, The 13th International Conference on Advanced Materials and Devices (ICAMD2023), 2023-12-04
-
7
Generation of Probabilistic Bits by Exploiting Spin-Orbit Torque Switching in Magnetic Trilayer
Han, DongHyeon; Shin, Chaehyeon; Kim, Seok-Jong; Jang, Yunho; Lee, Geun-hee; Ryu, Jeongchun; Kohda, Makoto; Nitta, Junsaku; Kim, Kab-Jin; Park, Jongsun; Lee, Kyung-Jin; Park, Byong-Guk, The 13th International Conference on Advanced Materials and Devices (ICAMD2023), 2023-12-04
-
8
중엔트로피 초내열 합금의 기계적 특성 및 고온 강화기구 해석 연구
공태영; 류호진; 홍순형, 한국분말재료학회 2023 추계학술발표회, 2023-12-01
-
9
Plasmonic SERS Biosensor for Rapid and Accurate Bacterial Identification
Ko, JiWoo; Jung, Yeon Sik, 2023 MRS Fall Meeting & Exhibit, 2023-12-01
-
10
Hydrodynamically-Modulated Dewetting of Colloidal Solution for Physical Unclonable Functions
Cho, Yeongin; Pyeon, Jeongsu; Kim, Hyoungsoo; Jung, Yeon Sik, 2023 MRS Fall Meeting & Exhibit, 2023-11-29
Collection's Items (Sorted by Submit Date in Descending order): 5101 to 5120 of 7321
| 전착된 ZnS:Ag,Cl 형광체의 최적 접착력과 발광을 위한 열처리 조건에 관한 연구 Jeon, Duk Young, 1999 한국요업학회 추계학술대회, pp.76 -, 한국요업학회, 1999-01-01 |
| 전해도금법을 이용한 미세 Sn-Bi 솔더범프의 형성에 관한 연구 이원종; 정희록; 김영호, 대한금속재료학회 2002 추계학술대회, 2002-10-25 |
| Ir계 전극 위에 PECVD 법으로 증착한 PZT 박막의 증착 특성 및 전기적 특성 이원종, 제3회 고유전체 및 강유전체 소자/재료 workshop, pp.0 - 0, 2001-12-01 |
| PECVD 법으로 증착한 PZT박막의 fatigue 특성 및 누설전류 특성에 관한 연구 이원종, 한국재료학회 춘계학술발표대회, pp.0 - 0, 한국재료학회, 2001-05 |
| Discharge characteristics of coplanar type Xe plasma lamp for LCD backlight Lee, Won-Jong; Kim, HH; Kwon, EM; Rha, SK, 6th Asia Pacific Conference on Plasma Science and Technology, 2002-07-01 |
| PZT 박막 캐패시터에서의 잔류 분극의 relaxation 현상 이원종, 제3회 고유전체 및 강유전체 소자/재료 workshop, pp.0 - 0, 2001-12-01 |
| Effect of LaNiO3 Top Electrode on the Resistance of Pb(Zr,Ti)O3 Ferroelectric Capacitor to Hydrogen Damage and Fatigue 이원종, 제3회 고유전체 및 강유전체 소자/재료 workshop, pp.0 - 0, 2001-12-01 |
| Evaluation of Thermal Shear Strains in Flips-chip Package by Electronic Speckle Pattern Interferometry (ESPI) Jang, W; Lee, BW; Kim, DW; Nah, JW; Paik, Kyung-Wook; Kwon, D, Proceeding of the 3rd International Symposium on Electronic Materials and Packaging 2001, pp.310 - 314, 2001-11 |
| Fatigue endurance of PZT capacitor prepared on Ir electrode 이원종, 한국재료학회, pp.0 - 0, 2001-10-01 |
| Fatigue Endurance of CVD-PZT Films Deposited on Ir Electrodes for FeRAM Devices Lee, Won-Jong, 1st International Meeting on FeRAM, pp.101 - 102, 2001-11-01 |
| ESPI와 유한요소해석을 이용한 플립칩 솔더볼의 유동특성 평가 이백우; 정증현; 김주영; 나재웅; 백경욱; 권동일, 대한용접학회 2002년도 춘계학술발표대회, pp.278 - 281, 대한용접학회, 2002-05 |
| High frequency measurement and characterization of ACF flip chip interconnects 권운성; 임명진; 백경욱, 한국마이크로전자 및 패키징학회 2001년도 추계 기술심포지움, pp.146 - 150, 한국마이크로전자 및 패키징학회, 2001-11 |
| Cu pad 위에 무전해 도금된 플립칩 UBM 과 비솔더 범프에 관한 연구 백경욱, The Microelectronics and Packaging Society, IMAPS-Korea Workshop 2001, pp.95 - 99, The Microelectronics and Packaging Society, 2001-07-01 |
| Dynamic mechanical properties of EPDM rubber matrix composites for underwater acoustic backing materials Hong, Soon Hyung, pp.562 - 567, 2002-01-01 |
| Fabrication process of laminated composite by SHS reaction Hong, Soon Hyung, Spring meeting of Korean Society of Composite Materials, pp.155 - 158, 복합재료학회, 2002-01-01 |
| Effect of Hot Deformation in Non-Recrystallization Region on Austenite/Ferrite Phase Transformation of C-Mn-Si-Nb Steel Hong, Soon Hyung, pp.185 - 188, 2002-01-01 |
| Electroless Ni Bumped Flip Chip Interconnection on an Organic Substrate using Anisotropic Conductive Adhesives/Films (ACAs/ACFs) Paik, Kyung-Wook, Int. Advanced Tech. Workshop on Flip Chip Technology, pp.0 - 0, 1999-03-01 |
| Understanding of Anisotropic Conductive Films(ACFs)/Adhesives(ACAs) for Packaging Applications Paik, Kyung-Wook, Pan Pacific Microelectronics Symposium, pp.0 - 0, 1999-02-01 |
| Effect of Precipitation of V-Carbonitrides on the Ferrite Grain Refinement in a Tempered Martensite Structure of a C-Mn-V Steel Park, Joong Keun, International Symposium on Ultrafine Grained Steels, 2001-09-21 |
| In-Situ Measurement of the Decomposition Kinetics of α Phase in the γ-Based Ti-Al Alloys Park, Joong Keun, 2nd Int. Conf. Light Materials for Transportation Systems, LiMAT-2001, 2001-05-03 |
Discover
Type
- 12 Article
- 1 Book
- 7,308 Conference
Date issued
- 691 2020 - 2023
- 2,574 2010 - 2019
- 2,236 2000 - 2009
- 1,492 1990 - 1999
- 318 1980 - 1989