ESPI와 유한요소해석을 이용한 플립칩 솔더볼의 유동특성 평가Flow Properties Evaluation of flip-chip solder using ESPI and FEA
- Publisher
- 대한용접학회
- Issue Date
- 2002-05
- Language
- KOR
- Citation
대한용접학회 2002년도 춘계학술발표대회, pp.278 - 281
- Appears in Collection
- MS-Conference Papers(학술회의논문)
- Files in This Item
- There are no files associated with this item.
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.