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Results 241-250 of 250 (Search time: 0.005 seconds).
| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Nanofiber anisotropic conductive adhesives (ACAs) for ultra fine pitch chip-on-film (COF) packaging Suk, KL; Chung, CK; Paik, Kyung-Wook, 2011 61st Electronic Components and Technology Conference, ECTC 2011, pp.656 - 660, ECTC, 2011-05-31 | |
| Nanofiber ACFs (anisotropic conductive films) for ultra-fine pitch interconnection Paik, Kyung-Wook; Lee, Sang-Hoon; Kim, Tae-Wan, 15th IEEE International Conference on Nanotechnology, IEEE-NANO 2015, pp.581 - 587, Institute of Electrical and Electronics Engineers Inc., 2015-07 | |
| Effects of Cu/Al intermetallic compound (IMC) on copper wire and aluminum pad bondability Kim, HJ; Lee, YJ; Paik, Kyung-Wook; Koh, KW; Woon, JH; Choi, SH; Lee, J; Moon, JT; Park, YJ, Proceeding of the 3rd International Symposium on Electronic Matericals and Packaging 2001, pp.44 - 51, International Symposium on Electronic Matericals and Packaging, 2001-11 | |
| Effects of particle size on dielectric constant and leakage current of epoxy/barium titanate (BaTiO3) composite films for embedded capacitors Cho, SD; Lee, JY; Paik, Kyung-Wook, Proceeding of the 3rd International Symposium on Electronic Matericals and Packaging, pp.63 - 68, 3rd International Symposium on Electronic Matericals and Packaging, 2001-11-01 | |
| New Anisotropic Conductive Adhesives for Low Cost and Reliable Flip Chip on Organic Substrates Applications Yim, MJ; Paik, Kyung-Wook, 2000 Int’l Symp on Electronic Materials & Packaging, pp.282 - 288, 2000 Int’l Symp on Electronic Materials & Packaging, 2000-11-01 | |
| Study on Coined Solder Bumps on Micro-via PCBs Nah, JW; Paik, Kyung-Wook; Kim, WH; Hur, KR, Proceeding of the 3rd International Symposium on Electronic Materials and Packaging , pp.115 - 120, 3rd International Symposium on Electronic Materials and Packaging, 2001-11 | |
| Numerical Analysis of the Formation of Coined Solder Bumps Hwnag, TK; Lee, SB; Nah, JW; Paik, Kyung-Wook, Proceeding of the 3rd International Symposium on Electronic Materials and Packaging , pp.388 - 392, 3rd International Symposium on Electronic Materials and Packaging, 2001-11 | |
| Flip chip assembly on organic boards using anisotropic conductive adhesives (ACAs) and nickel/gold bumps Yim, MJ; Jeon,YD; Paik, Kyung-Wook, 2000 Electronics Packaging Technology Conference(3rd EPTC), pp.378 - 384, EPTC, 2000-12-01 | |
| Thermo-Mechanical Stresses in Laminated Polymer Films on Silicon Substrates Paik, Kyung-Wook; Kim, JS; Oh, SH; Seo, HS, International Conference and Exhibition on Multichip Modules and High Density Packaging, pp.449 - 453, International Conference and Exhibition on Multichip Modules and High Density Packaging, 1998-04-01 | |
| In-situ moiré measurement of adhesive flip-chip bonded assembly under thermal cycling condition Ham, SJ; Kwon, WS; Paik, Kyung-Wook; Lee, Soon-Bok, 2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, pp.63 - 67, IEEE, 2002-06 |
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