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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

Effects of Cu/Al intermetallic compound (IMC) on copper wire and aluminum pad bondability

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Kim, HJ / Lee, YJ / Paik, Kyung-Wookresearcher / Koh, KW / Woon, JH / Choi, SH / Lee, J / Moon, JT / Park, YJ
Publisher
International Symposium on Electronic Matericals and Packaging
Issue Date
2001-11
Language
English
Citation

Proceeding of the 3rd International Symposium on Electronic Matericals and Packaging 2001, pp.44 - 51

URI
http://hdl.handle.net/10203/131632
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MS-Conference Papers(학술회의논문)
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