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Results 11-20 of 250 (Search time: 0.005 seconds).
| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Epoxy/BaTiO (SrTiO3) Composite Films and Pastes for High Dielectric Constant and Low Tolerance Embedded Capacitors in Organic Substrates Paik, Kyung-Wook; Hyun, JG; Lee, S; Jang, KW, Pan Pacific Microelectronics Symposium & Tabletop Exhibition, pp.0 - 0, 2006-01 | |
| Flip-Chip-on-Glass(FCOG) Technology using Electroless Ni/Cu/Au bump and ACF for LCD Packaging Paik, Kyung-Wook, Liquid Crystal Materials and Device '99, pp.199 - 204, 1999-09-01 | |
| Study on the Under Bump Metallutgy(UBM) for electro-plated Eutectic Pb/Sn Soder Bumps on Organic Substrates Paik, Kyung-Wook; Jang, SY, Pan Pacific Microelectronics Symposium, pp.173 - 179, 1999-02-01 | |
| Development of New Ion Beam Modification Techniques to Enhance Copper and Polyimide Adhesion in Multilevel Electronic Packaging Paik, Kyung-Wook, Proc. Mat. Res. Soc. Symp, pp.21 - 26, 1989-03-01 | |
| Interfacial Studies on the Electroplated Eutectic Pb/Sn Flip-Chip Solder Bump and UBM (Under Bump Metallurgy) Paik, Kyung-Wook, International Conference on Electronic Materials, pp.0 - 0, 1998-05-01 | |
| Eutectic Pb/Sn Solder Bump and Under Bump Metallurgy(UBM) Interfacial Reaction and Adhesion Paik, Kyung-Wook, 2nd electronic Packaging Technology Conference, pp.69 - 75, 1998-03-01 | |
| Thermo-Mechanical Stresses in Lamination Based Si Monolithic MCM-D Substrates Paik, Kyung-Wook, Materials Research Society Spring Meeting, pp.192 - 192, 1998-05-01 | |
| Pd-Free Bumping Technology and UBM (Under Bump Metallurgy) Jang, SY; Paik, Kyung-Wook; Wolf, J; Reichl, H, Proceeding of the 3rd International Symposium on Electronic Materials and Packaging 2001, pp.121 - 128, 2001-11-01 | |
| Thin film integral capacitor fabricated on a polymer dielectric for high density interconnect (HDI) applications Paik, Kyung-Wook; Lu, Toh-Ming, Proceedings of the Spring Meeting on MRS, v.390, pp.33 - 38, 1995-04-17 | |
| Studies on the High Temperatute Superconductor (HTS)/Metal/Polymer Dielectric Interconnect Structure for Packaging Applications Paik, Kyung-Wook; Mogro-Campero, A; Turner, L, 44th ECTC Proceeding, pp.326 - 336, 1994-03-01 |
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