Studies on the High Temperatute Superconductor (HTS)/Metal/Polymer Dielectric Interconnect Structure for Packaging Applications

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Issue Date
1994-03-01
Language
ENG
Citation

44th ECTC Proceeding, pp.326 - 336

URI
http://hdl.handle.net/10203/115250
Appears in Collection
MS-Conference Papers(학술회의논문)
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