Eutectic Pb/Sn Solder Bump and Under Bump Metallurgy(UBM) Interfacial Reaction and Adhesion
- Issue Date
- 1998-03-01
- Language
- ENG
- Citation
2nd electronic Packaging Technology Conference, pp.69 - 75
- Appears in Collection
- MS-Conference Papers(학술회의논문)
- Files in This Item
- There are no files associated with this item.
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