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Results 381-390 of 526 (Search time: 0.005 seconds).
| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Effect of power supply imbalance on nf of CMOS low noise amplifier for UHF RFID applications Koo, K.; Shim, J.; Park, H.; Kim, Joungho, Asia-Pacific Symposium on Electromagnetic Compatibility and 19th International Zurich Symposium on Electromagnetic Compatibility, APEMC 2008, pp.431 - 434, 123, 2008-05-19 | |
| Jitter suppressed on-chip clock distribution using package plane cavity resonance Lee, W.; Ryu, C.; Park, J.; Kim, Joungho, 2008 Asia-Pacific Symposium on Electromagnetic Compatibility and 19th International Zurich Symposium on Electromagnetic Compatibility, APEMC 2008, pp.427 - 430, IEEE, 2008-05-19 | |
| Noise figure degradation analysis of power/ground noise on 900MHz LNA for UHF RFID Koo, K.; Park, H.; Shim, Y.; Kim, Joungho, 9th Electronics Packaging Technology Conference, EPTC 2007, pp.416 - 420, IEEE, 2007-12-12 | |
| High frequency electrical model of through wafer via for 3-D stacked chip packaging Ryu, C.; Lee, J.; Lee, H.; Lee, K.; Oh, T.; Kim, Joungho, ESTC 2006 - 1st Electronics Systemintegration Technology Conference, pp.215 - 220, IEEE, 2006-09-05 | |
| Modeling and simulation of IC and package power/ground network Park, H.; Gam, D.G.; Kim, Joungho; Kim, H., 2006 IEEE International Symposium on Electromagnetic Compatibility, EMC 2006, pp.696 - 701, IEEE, 2006-08-14 | |
| Modeling and measurement of board-level ESD from power/ground plane charged by low-voltage for investigation of decoupling capacitor effects in Printed Circuit Boards (PCBs) Sung, H.; Kim, M.; Lee, W.; Yoon, C.; Koo, K.; Kwon, J.; Kim, Joungho, 12th Electronics Packaging Technology Conference, EPTC 2010, pp.773 - 776, EPTC 2010, 2010-12-08 | |
| Characterization of on-chip Interconnections and capacitive coupling effect on CMOS operational amplifier Shim ,Y.; Pak, J.; Kim, A.; Kim, Joungho, 20th International Zurich Symposium on Electromagnetic Compatibility, EMC Zurich 2009, pp.449 - 452, EMC, 2009-01-12 | |
| Partial EBG power distribution network using remants of signal layers in multi-layer PCB Lee, Junho; Kim, Youngwon; Song, Eakhwan; Kim, Joungho, 2006 IEEE International Symposium on Electromagnetic Compatibility, EMC 2006, pp.43 - 46, IEEE, 2006-08-14 | |
| Microwave frequency model of flip-chip interconnects using anisotropic conductive film Ryu, Woong Hwan; Yim, Myung-Jin; Lee, Junho; Jeon, Young-Doo; Ahn, Seung Young; Yun, Young-Hwan; Ham, Seog-Heon; Lee, Yong-Hee; Paik, Kyung-Wook; Kim, Joungho, Proceedings of the 1999 International Conference on High Density Packaging and MCMs, pp.311 - 315, SPIE, 1999-04-06 | |
| Analytical Expressions for Maximum Transferred Power in Wireless Power Transfer Systems Kogn, Sunkyu; Kim, Myunghoi; Koo, Kyongchoul; Ahn, Seungyoung; Bae, Bumhee; Kim, Joungho, 2011 IEEE Electromagnetic Compatibility Symposium, 2011 IEEE Electromagnetic Compatibility Symposium, 2011-08-17 |
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