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College of Engineering(공과대학)School of Electrical Engineering(전기및전자공학부)EE-Conference Papers(학술회의논문)

Microwave frequency model of flip-chip interconnects using anisotropic conductive film

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Ryu, Woong Hwan / Yim, Myung-Jin / Lee, Junho / Jeon, Young-Doo / Ahn, Seung Young / Yun, Young-Hwan / Ham, Seog-Heon / Lee, Yong-Hee / Paik, Kyung-Wookresearcher / Kim, Jounghoresearcher
Publisher
SPIE
Issue Date
1999-04-06
Language
English
Citation

Proceedings of the 1999 International Conference on High Density Packaging and MCMs, pp.311 - 315

URI
http://hdl.handle.net/10203/125776
Appears in Collection
MS-Conference Papers(학술회의논문)EE-Conference Papers(학술회의논문)
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