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Results 11-20 of 46 (Search time: 0.006 seconds).
| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Signal quality test with 3-dimensional BER opening for non-coherent Ultra Wide-Band (UWB) System-in-Package (SiP) Yoon, C.; Kim, Joungho; Kim, J., 2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009, 2009-12-02 | |
| Through Silicon Via (TSV) shielding structures Cho, J.; Kim, Joungho; Song, T.; Pak, J.S.; Kim, J.; Lee, H.; Lee, J.; Park K., 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010, pp.269 - 272, IEEE, 2010-10-25 | |
| Impact of partial EBG PDN on PI, SI and lumped model-based correlation Lee, J.; Lee, H.; Park, K.; Chung, B.; Kim, J.; Kim, Joungho, 2008 Asia-Pacific Symposium on Electromagnetic Compatibility and 19th International Zurich Symposium on Electromagnetic Compatibility, APEMC 2008, pp.168 - 171, 2008-05-19 | |
| Modeling and analysis of die-to-die vertical coupling in 3-D IC Lee, S.; Kim, G.; Kim, J.; Song, T.; Lee, J.; Lee, H.; Park, K.; Kim, Joungho, 2009 11th Electronic Packaging Technology Conference, EPTC 2009, pp.707 - 711, 2009-12-09 | |
| Guard ring effect for Through Silicon Via (TSV) noise coupling reduction Cho, J.; Yoon, K.; Pak, J.S.; Kim, J.; Lee, J.; Lee, H.; Park, K.; Kim, Joungho, 2010 IEEE CPMT Symposium Japan, ICSJ10, IEEE, 2010-08-24 | |
| An estimation method of chip level power distribution network inductance using full wave simulation and segmentation method Kim, J.; Shim, J.; Lee, W.; Pak, J.S.; Kim, Joungho, 2008 Asia-Pacific Symposium on Electromagnetic Compatibility and 19th International Zurich Symposium on Electromagnetic Compatibility, APEMC 2008, pp.339 - 342, 2008-05-19 | |
| Modeling and analysis of differential signal Through Silicon Via (TSV) in 3D IC Kim, J.; Pak, J.S.; Cho, J.; Lee, J.; Lee, H.; Park, K.; Kim, Joungho, 2010 IEEE CPMT Symposium Japan, ICSJ10, IEEE, 2010-08-24 | |
| Spread spectrum clock generator with delay cell array to reduce the EMI from a high-speed digital system Kim, J.; Kam, D.G.; Kim, Joungho, 2004 International Symposium on Electromagnetic Compatibility, EMC 2004, v.3, pp.820 - 825, IEEE, 2004-08-09 | |
| Modeling of hierarchical power/ground network based on segmentation method for package/board co-design and simulation Kim, J.; Jeong, Y.; Kim, J.; Lee, J.; Shim, J.; Kim, Joungho, 2006 IEEE International Symposium on Electromagnetic Compatibility, EMC 2006, pp.16 - 19, IEEE, 2006-08-14 | |
| Through silicon via (TSV) equalizer Kim, Joungho; Song, E.; Cho, J.; Pak, J.S.; Lee, J.; Lee, H.; Kim, J., 2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS '09, pp.13 - 16, 123, 2009-10-19 |