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Browse "EE-Conference Papers(학술회의논문)" by Author Kim, G.

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Showing results 1 to 16 of 16

1	3D strip meander delay line structure for multilayer LTCC-based SiP applications Kim, G.; Lu A.C.W.; Wei, F.; Wai, L.L.; Kim, Joungho, 2008 58th Electronic Components and Technology Conference, ECTC, pp.2081 - 2085, 2008-05-27
2	A 57mW embedded mixed-mode neuro-fuzzy accelerator for intelligent multi-core processor Oh, J.; Park, J.; Kim, G.; Lee, S.; Yoo, Hoi-Jun, 2011 IEEE International Solid-State Circuits Conference, ISSCC 2011, pp.130 - 131, IEEE, 2011-02-20
3	A low cost single-pass fractional motion estimation architecture using bit clipping for H.264 video codec Kim, G.; Kim, J.; Kyung, Chong-Min, 2010 IEEE International Conference on Multimedia and Expo, ICME 2010, pp.661 - 666, IEEE, 2010-07-19
4	A low-energy hybrid radix-4/-8 multiplier for portable multimedia applications Kim, G.; Lee, S.; Park, J.; Yoo, Hoi-Jun, 2011 IEEE International Symposium of Circuits and Systems, ISCAS 2011, pp.1171 - 1174, IEEE, 2011-05-15
5	Chip-package co-design of power distribution network for system-in-package applications Kim, G.; Kam, D.G.; Chung, D.; Kim, Joungho, 6th Electronics Packaging Technology Conference, EPTC 2004, pp.499 - 501, IEEE, 2005-12-08
6	Design of energy-aware video codec-based system Na, S.; Kim, J.; Kim, J.; Kim, G.; Kyung, Chong-Min, 1st International Conference on Green Circuits and Systems, ICGCS 2010, pp.201 - 206, 1st International Conference on Green Circuits and Systems, ICGCS 2010, 2010-06-21
7	Event statistics and criticality-aware bitrate allocation to minimize energy consumption of memory-constrained wireless surveillance system Kim, J.; Kim, J.; Kim, G.; Na, S.; Yoo, S.; Kyung, Chong-Min, IEEE International Conference on Multimedia and Expo, ICME 2010, pp.7 - 12, IEEE, 2010-07-19
8	Lifetime maximization of mobile wireless camera system Kim, G.; Kim, J.; Kim, T.-R.; Kyung, Chong-Min, 2010 International SoC Design Conference, ISOCC 2010, pp.240 - 243, 2010 International SoC Design Conference, ISOCC 2010, 2010-11-22
9	Mode-impedance method for modeling and analysis of crosstalk in differential meander delay lines Kim, G.; Kim, J.; Lee, S.; Kim, J.; Kim, Joungho, 2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008, pp.93 - 96, IEEE, 2008-12-10
10	Modeling and analysis of coupling between TSVs, metal, and RDL interconnects in TSV-based 3D IC with silicon interposer Yoon, K.; Kim, G.; Lee, W.; Song, T.; Lee, J.; Lee, H.; Park, K.; et al, 2009 11th Electronic Packaging Technology Conference, EPTC 2009, pp.702 - 706, 2009-12-09
11	Modeling and analysis of die-to-die vertical coupling in 3-D IC Lee, S.; Kim, G.; Kim, J.; Song, T.; Lee, J.; Lee, H.; Park, K.; et al, 2009 11th Electronic Packaging Technology Conference, EPTC 2009, pp.707 - 711, 2009-12-09
12	Networks-in-package; design, analysis and implementation Kim, G.; Lee, K.; Kim, J.; Bae, K.; Lee, C.; Yoo, H.-J.; Kim, Joungho, 14th Topical Meeting on Electrical Performance of Electronic Packaging, EPEP, pp.221 - 224, IEEE, 2006-10-23
13	Networks-on-chip and networks-in-package for high-performance SoC platforms Lee, K.; Lee, S.-J.; Kim, D.; Kim, K.; Kim, G.; Kim, Joungho; Yoo, Hoi-Jun, 1st IEEE Asian Solid-State Circuits Conference, ASSCC 2005, pp.485 - 488, IEEE, 2005-11-01
14	Precise analysis and modeling of far-end crosstalk and far-end crosstalk saturation using mode analysis in coupled microstrip lines Kim, G.; Song, E.; Kim, Ji Seong; Kim, Joungho, 2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009, 2009-12-02
15	TDR/TDT analysis by crosstalk in single and differential meander delay lines for high speed PCB applications Kim, G.; Kam, D.G.; Kim, Joungho, 2006 IEEE International Symposium on Electromagnetic Compatibility, EMC 2006, pp.657 - 662, IEEE, 2006-08-14
16	Wideband low power distribution network impedance of high chip density package using 3-D stacked through silicon vias Pak, J.S.; Ryu, C.; Kim, J.; Shim, Y.; Kim, G.; Kim, Joungho, 2008 Asia-Pacific Symposium on Electromagnetic Compatibility and 19th International Zurich Symposium on Electromagnetic Compatibility, APEMC 2008, pp.351 - 354, IEEE, 2008-05-19

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