Wideband low power distribution network impedance of high chip density package using 3-D stacked through silicon vias

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Publisher
IEEE
Issue Date
2008-05-19
Language
ENG
Citation

2008 Asia-Pacific Symposium on Electromagnetic Compatibility and 19th International Zurich Symposium on Electromagnetic Compatibility, APEMC 2008, pp.351 - 354

URI
http://hdl.handle.net/10203/17008
Appears in Collection
EE-Conference Papers(학술회의논문)
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Wideband Low Power Distribution Network Impedance of High Chip Density Package.pdf(677.43 kB)Download

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