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Networks-in-package; design, analysis and implementation

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Kim, G. / Lee, K. / Kim, J. / Bae, K. / Lee, C. / Yoo, H.-J. / Kim, Jounghoresearcher
Publisher
IEEE
Issue Date
2006-10-23
Language
English
Citation

14th Topical Meeting on Electrical Performance of Electronic Packaging, EPEP, pp.221 - 224

URI
http://hdl.handle.net/10203/534
Appears in Collection
EE-Conference Papers(학술회의논문)
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