LEE, YONGJIN; Jang, Woojin; BAE, HONGHYUN; CHO, JEONGHYUN; Kim, Hyun-Sik, 2024 IEEE International Solid-State Circuits Conference (ISSCC), pp.272 - 273, 2024-02-18
PARK, YOUSUNG; Gang, Gyeong-Gu; LIM, GYUWAN; Shin, seunghwa; Ahn, Yong-Sung; Kim, Wonyoun; Kim, Hyun-Sik, 2024 IEEE International Solid-State Circuits Conference (ISSCC), pp.432 - 433, 2024-02-18
Lee, Jun-Gi; BAE, HONGHYUN; Jang, Seunghyun; Kim, Hyun-Sik, 2024 IEEE International Solid-State Circuits Conference (ISSCC), pp.456 - 457, 2024-02-18
HAN, HYUNKI; CHO, JEONGHYUN; Jang, Woojin; PARK, YOUSUNG; LEE, JIHO; Kim, Hyun-Sik, 2024 IEEE International Solid-State Circuits Conference (ISSCC), pp.464 - 465, 2024-02-18
Kim, Daehyeon; Kim, Hyun-Sik, 2024 IEEE International Solid-State Circuits Conference (ISSCC), pp.146 - 147, 2024-02-18
Lee, Donghwan, 62nd IEEE Conference on Decision and Control, 2023-12-24
이현우; Nahrendra, I Made Aswin; 이승현; 이동규; 노승규; 명현, 제어로봇시스템학회 대전충청지부 학술대회 (ICROS 2023), 2023-12-21
이승현; 최덕규; 박재헌; 명현, 제어로봇시스템학회 대전충청지부 학술대회 (ICROS 2023), 2023-12-21
Cho, Yucheol; Choi, Geunseok; Ham, Gyeongdo; Shin, Mincheol; Kim, Dae-Shik, NeurIPS workshop on Machine Learning and the Physical Sciences, 2023, 2023-12-15
Kim, Jeonghye; Kim, Woojun; Lee, Suyoung; Sung, Youngchul, Foundation Models and Decision Making (FMDM) Workshop, NeurIPS 2023, 2023-12-15
Modeling and analysis of multiple coupled through-silicon vias (TSVs) for 2.5-D/3-D ICs Cho, Kyungjun; Kim, Youngwoo; Park, Junyong; Kim, Hyesoo; Kim, Seongguk; Kim, Subin; Park, Gap Yeol; et al, Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility, EMC Sapporo/APEMC 2019, pp.346 - 349, Institute of Electrical and Electronics Engineers Inc., 2019-06 |
Cooperative UAV Jammer for Enhancing Physical Layer Security: Robust Design for Jamming Power and Trajectory Roh, Yujung; Jung, Seungjae; Kang, Joonhyuk, IEEE Military Communications Conference, MILCOM 2019, Institute of Electrical and Electronics Engineers Inc., 2019-11 |
Radar Imaging Based on IEEE 802.11ad Waveform Han, Geonho; Choi, Junil, IEEE Global Communications Conference, GLOBECOM 2020, Institute of Electrical and Electronics Engineers Inc., 2020-12 |
Audio frequency ground integrity modeling and measurement for a TDMA smartphone system Park, Shinyoung; Song, Jinwook; Kim, Subin; Lee, Man Ho; Kim, Jonghoon; Kim, Joungho, IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2016, pp.3 - 5, Institute of Electrical and Electronics Engineers Inc., 2016-12 |
Coding across heterogeneous parallel erasure broadcast channels is useful Kim, Sunghyun; Mohajer, Soheil; Suh, Changho, IEEE International Symposium on Information Theory, ISIT 2017, pp.1883 - 1887, Institute of Electrical and Electronics Engineers Inc., 2017-06 |
Iterative Normalized Matched Filtering for Detection of Chemical Agents in Hyperspectral Imaging Yu, Hyeong-Geun; Lee, Jay-Hoon; Park, Dong-Jo; Nam, Hyun-Woo; Park, Byeong-Hwang, IEEE International Conference on Consumer Electronics - Asia, ICCE-Asia 2018, Institute of Electrical and Electronics Engineers Inc., 2018-06 |
On Full-Duplex Communication in Cooperative Cognitive Radio Networks Lee, Seungwon; Park, Sangwoo; Song, Iickho; Zhang, Yalei; Nguyen, Mai TP, International Conference on Computational Science and Computational Intelligence, CSCI 2016, pp.1414 - 1415, Institute of Electrical and Electronics Engineers Inc., 2016-12 |
Receding horizon–based RRT* algorithm for a UAV real-time path planner Lee, Hanseob; Lee, Dasol; Shim, David Hyunchul, AIAA Information Systems-Infotech At Aerospace Conference, 2017, American Institute of Aeronautics and Astronautics Inc, AIAA, 2017-01 |
Behavior Selection of Social Robots Using Developmental Episodic Memory-Based Mechanism of Thought Ko, Woo-Ri; Kim, Jong-Hwan, IEEE International Conference on Consumer Electronics - Asia, ICCE-Asia 2018, Institute of Electrical and Electronics Engineers Inc., 2018-06 |
Design and Analysis of Thermal Transmission Line based Embedded Cooling Structures for High Bandwidth Memory Module and 2.5D/3D ICs Son, Keeyoung; Kim, Subin; Park, Shinyoung; Park, Hyunwook; Kim, Keunwoo; Shin, Taein; Kim, Minsu; et al, IEEE Electrical Design of Advanced Packaging and Systems, EDAPS 2020, Institute of Electrical and Electronics Engineers Inc., 2020-12 |
A Single-Supply Buffer-Embedding SAR ADC with Skip-Reset having Inherent Chopping Capability Seo, Min-Jae; Jin, Dong-Hwan; Kim, Ye Dam; Kim, Jong-Pal; Chang, Dong-Jin; Lim, Won-Mook; Chung, Jaehyun; et al, 15th IEEE Asian Solid-State Circuits Conference, A-SSCC 2019, pp.189 - 192, Institute of Electrical and Electronics Engineers Inc., 2019-11 |
A Reference-Less Time-Division-Duplex Transceiver IC for a 5-Fr 6-Electrode Renal Denervation Catheter in 0.18-μm 70-V BCDMOS Yang, Jaehyeok; Kim, Seohyeon; Hwang, Gunpil; Kwon, Kyeongha; Jeon, Sejun; Bae, Hyeon-Min, 40th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBC 2018, pp.4154 - 4157, Institute of Electrical and Electronics Engineers Inc., 2018-07 |
A new receiver-side integrated regulator with phase shift control strategy for wireless power transfer system Lee, Youngdal; Kim, Dong-Min; Kim, Chong-Eun; Moon, Gun-Woo, IEEE PELS Workshop on Emerging Technologies: Wireless Power Transfer, WoW 2020, pp.112 - 115, Institute of Electrical and Electronics Engineers Inc., 2020-11 |
Cost-effective auto-alignment method for indoor optical wireless communication Cho, Seung-Rae; Lee, Kwanyong; Kye, Myeonggyun; Lee, Chang-Hee, Asia Communications and Photonics Conference, ACP 2017, OSA - The Optical Society, 2017-11 |
Concept Design for Mole-Like Excavate Robot and Its Localization Method Lee, Junseok; Lim, HyunJun; Song, Seungwon; Myung, Hyun, 7th International Conference on Robot Intelligence Technology and Applications, RiTA 2019, pp.56 - 60, Institute of Electrical and Electronics Engineers Inc., 2019-11 |
Novel Query Tree Algorithm Based on Reservation and Time-Divided Responses to Support Efficient Anti-Collision Protocol Choi, Ji-Hwan; Lee, Hyuck-Jae, 10th International Conference on Ubiquitous and Future Networks, ICUFN 2018, pp.421 - 425, IEEE Computer Society, 2018-07 |
Generalized subband-filtered and pulse-shaped multicarrier for quasi-synchronous uplink access Shin, Wooram; Park, Giyoon; Wunder, Gerhard; Baek, SeungKwon; Kang, Joonhyuk, 28th Annual IEEE International Symposium on Personal, Indoor and Mobile Radio Communications, PIMRC 2017, pp.1 - 7, Institute of Electrical and Electronics Engineers Inc., 2018-10 |
Predictive coding-based deep dynamic neural network for visuomotor learning Hwang, Jungsik; Kim, Jinhyung; Ahmadi, Ahmadreza; Choi, Minkyu; Tani, Jun, 7th Joint IEEE International Conference on Development and Learning and on Epigenetic Robotics, ICDL-EpiRob 2017, pp.132 - 139, Institute of Electrical and Electronics Engineers Inc., 2017-09 |
A study on the high frequency performance of solder ACFs joints for flex-on-board applications using coplanar waveguide Zhang, Shuye; Lin, Tiesong; He, Peng; Park, Junyong; Park, Gap Yeol; Song, Huijin; Kim, Joungho; et al, 68th IEEE Electronic Components and Technology Conference, ECTC 2018, pp.2404 - 2409, Institute of Electrical and Electronics Engineers Inc., 2018-05 |
Signal integrity analysis of vertical dual port coaxial connector for automotive system Kim, Dong-Hyun; Lee, Hyunsuk; Kim, Hongseok; Kim, Jonghoon; Kim, Joungho; Park, Jung-Min; Kim, Ji-Min; et al, 25th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2016, pp.165 - 167, Institute of Electrical and Electronics Engineers Inc., 2016-10 |
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