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| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Modeling and Signal Integrity Analysis of Mounting Pad with Layer-cutting to reduce Impedance Mismatch for Dual-In-Line Memory Module (DIMM) Kim, Hyun Woong; Kim, Jongwook; Song, Kyunghwan; Lee, Seonghi; Kim, Keunwoong; Kim, Seongguk; Lho, Daehwan; Kim, Hyunsik; Park, Minho; Ahn, Seungyoung, Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), IEEE Electronics Packaging Society, 2021-10 | |
| Deep Reinforcement Learning-based Power Distribution Network Structure Design Optimization Method for High Bandwidth Memory Interposer Lee, Seonghi; Kim, Hyun Woong; Song, Kyunghwan; Kim, Jongwook; park, dongryul; Ahn, Jangyong; Kim, Keunwoo; Ahn, Seungyoung, 30th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2021, Institute of Electrical and Electronics Engineers Inc., 2021-10-19 | |
| Deep Reinforcement Learning-based Decoupling Capacitor Optimization Method for Multi-Power Domain considering Transfer Noise in 3D-ICs Lee, Seonghi; Kim, Hyun Woong; Park, Dongryul; Ahn, Jangyong; Ryu, Seunghun; Park, Gagyeong; Ahn, Seungyoung, 2022 IEEE Electrical Design of Advanced Packaging and Systems, EDAPS 2022, Institute of Electrical and Electronics Engineers Inc., 2022-12-13 | |
| Design and Analysis of Double-side Characteristic Impedance Compensation Structure in 2.5D / 3D Package for High-speed Serial Link Lee, Seonghi; Kim, Hyun Woong; Park, Jiyoung; Lee, Youngho; Moon, Sungwook; Ahn, Seungyoung, 2023 IEEE Symposium on Electromagnetic Compatibility and Signal/Power Integrity, EMC+SIPI 2023, pp.147 - 152, Institute of Electrical and Electronics Engineers Inc., 2023-08-02 | |
| Signal Integrity Analysis of Notch-Routing to Reduce Near-End Crosstalk for Tightly Coupled and Short Microstrip Channel Ryu, Seunghun; Kim, Hyun Woong; Lee, Seonghi; Park, Dongryul; Lee, Sanguk; Ahn, Seungyoung, 2023 IEEE Symposium on Electromagnetic Compatibility and Signal/Power Integrity, EMC+SIPI 2023, pp.131 - 136, Institute of Electrical and Electronics Engineers Inc., 2023-08-01 | |
| Signal Integrity Analysis of Wire Bonding Finger Capacitance to Reduce the Reflection of Multi-drop Topology for Low-Power Double Data Rate (LPDDR) Kim, Hyun Woong; Park, Gagyeong; Ryu, Seunghun; Kim, Jongwook; Lee, Jaehoon; Ahn, Seungyoung, 2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI), pp.141 - 146, IEEE, 2023-07-29 | |
| Noise Source Impedance Extraction Method of Switched-Mode Power Supply (SMPS) in PC According to the Frequency Range Rhee, Jaewon; Kim, Hyun Woong; Chu, Kwanguk; Ahn, Seungyoung, 2023 IEEE Symposium on Electromagnetic Compatibility and Signal/Power Integrity, EMC+SIPI 2023, pp.443 - 447, Institute of Electrical and Electronics Engineers Inc., 2023-08 |
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