Signal Integrity Analysis of Wire Bonding Finger Capacitance to Reduce the Reflection of Multi-drop Topology for Low-Power Double Data Rate (LPDDR)

Abstract

In this paper, in order to minimize the reflection generated in the multi-drop topology, the proposed structure to insert capacitance into the wire bonding finger using a high-K material is presented. The proposed structure can reduce the significant reflected signal due to multi-drop topology at a high-frequency range. Return loss is improved by about 2.26 dB and 0.24 dB, respectively, at 20 GHz for two loadings and four loadings systems, and the insertion loss is also improved due to this effect. Based on the eye diagram, the proposed structure, an additional height, and a width margin is obtained at 3.4 % and 2.0 % at 20 Gbps for four loadings system, respectively.