DSpace at KOASAS
Browsing DSpace

Browse "GT-Conference Papers(학술회의논문)" by Author Kim, Hyun Woong

A to Z

All 0-9

A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

or enter first few letters:

Showing results 1 to 7 of 7

1
Deep Reinforcement Learning-based Decoupling Capacitor Optimization Method for Multi-Power Domain considering Transfer Noise in 3D-ICs

Lee, Seonghi; Kim, Hyun Woong; Park, Dongryul; Ahn, Jangyong; Ryu, Seunghun; Park, Gagyeong; Ahn, Seungyoung, 2022 IEEE Electrical Design of Advanced Packaging and Systems, EDAPS 2022, Institute of Electrical and Electronics Engineers Inc., 2022-12-13

2
Deep Reinforcement Learning-based Power Distribution Network Structure Design Optimization Method for High Bandwidth Memory Interposer

Lee, Seonghi; Kim, Hyun Woong; Song, Kyunghwan; Kim, Jongwook; park, dongryul; Ahn, Jangyong; Kim, Keunwoo; et al, 30th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2021, Institute of Electrical and Electronics Engineers Inc., 2021-10-19

3
Design and Analysis of Double-side Characteristic Impedance Compensation Structure in 2.5D / 3D Package for High-speed Serial Link

Lee, Seonghi; Kim, Hyun Woong; Park, Jiyoung; Lee, Youngho; Moon, Sungwook; Ahn, Seungyoung, 2023 IEEE Symposium on Electromagnetic Compatibility and Signal/Power Integrity, EMC+SIPI 2023, pp.147 - 152, Institute of Electrical and Electronics Engineers Inc., 2023-08-02

4
Modeling and Signal Integrity Analysis of Mounting Pad with Layer-cutting to reduce Impedance Mismatch for Dual-In-Line Memory Module (DIMM)

Kim, Hyun Woong; Kim, Jongwook; Song, Kyunghwan; Lee, Seonghi; Kim, Keunwoong; Kim, Seongguk; Lho, Daehwan; et al, Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), IEEE Electronics Packaging Society, 2021-10

5
Noise Source Impedance Extraction Method of Switched-Mode Power Supply (SMPS) in PC According to the Frequency Range

Rhee, Jaewon; Kim, Hyun Woong; Chu, Kwanguk; Ahn, Seungyoung, 2023 IEEE Symposium on Electromagnetic Compatibility and Signal/Power Integrity, EMC+SIPI 2023, pp.443 - 447, Institute of Electrical and Electronics Engineers Inc., 2023-08

6
Signal Integrity Analysis of Notch-Routing to Reduce Near-End Crosstalk for Tightly Coupled and Short Microstrip Channel

Ryu, Seunghun; Kim, Hyun Woong; Lee, Seonghi; Park, Dongryul; Lee, Sanguk; Ahn, Seungyoung, 2023 IEEE Symposium on Electromagnetic Compatibility and Signal/Power Integrity, EMC+SIPI 2023, pp.131 - 136, Institute of Electrical and Electronics Engineers Inc., 2023-08-01

7
Signal Integrity Analysis of Wire Bonding Finger Capacitance to Reduce the Reflection of Multi-drop Topology for Low-Power Double Data Rate (LPDDR)

Kim, Hyun Woong; Park, Gagyeong; Ryu, Seunghun; Kim, Jongwook; Lee, Jaehoon; Ahn, Seungyoung, 2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI), pp.141 - 146, IEEE, 2023-07-29

Discover

rss_1.0 rss_2.0 atom_1.0