Browse "School of Electrical Engineering(전기및전자공학부)" by Type Conference
Showing results 12341 to 12360 of 22817
| Microscopic bit-level wear-leveling for NAND flash memory Song, Yong; Hwang, Woomin; Park, Ki-Woong; Park, Kyu Ho, 4th International Conference on Mobile, Ubiquitous, and Intelligent Computing, MUSIC 2013, pp.315 - 320, Springer Verlag, 2013-09 |
| Microsecond Optical Burst Add-Drop Multiplexing for WDM Ring Networks Yoo, H; Park, JP; Han, S; Cho, JS; Won, Yong Hyub; Lee, MS; Kang, Min Ho; et al, COIN 2005, pp.78 - 80, COIN, 2005-05-29 |
| Microshield transmission line and spiral inductor integrated on polymer thick film Ko J.-H.; Ho S.-S.; Kwon, Young Se, 2003 IEEE MTT-S International Microwave Symposium Digest, v.3, pp.2281 - 2284, 2003-06-08 |
| Microstripline 45o, 90o convertible phase shifter Yoon, Giwan, Int`l Conf. on Microwave & Millimeter Wave Technology, pp.363 - 366, 2002-08 |
| Microstructural characterization of heterointerfaces in MOCVD grown InGaAs/GaAs strained-layer system using cross section transmission electron micros Park, M. C.; Park, HyoHoon; Kwon, O. J., Inst. Phys. the Royal Microscopical Society Conference: Microscopy of Semiconducting Materials 1993, pp.481 - 484, 1993-04-05 |
| Microstructure and Optical Functions of Transparent Conductors and Their Impact on Collection in Amorphous Silicon Solar Cells Lim, Koeng Su; Ferreira, G.M.; Chen, C.; Ferlauto, A.S.; Rovira, P.I; An, I.; Wronski, C.R.; et al, 2003 MRS SPRING MEETING, v.762, pp.515 - 520, 2003-04-22 |
| Microwae Frequency Model and High-density design of Multiple Line Grid Array (MLGA) Package Kim, Joungho; Ahn, Seungyoung; Lee, Joonwoo; Kim, Jonghoon; Ryu, Woonghwan; Kim, Youngsoo; Choi, Hyun Seok; et al, IMAPS 2000, 2000 |
| Microwave Engineering Education at KAIST Ra, Jung Woong, Asia-Pacific Microwave Technology and Educatuon Workshop, 1991 |
| Microwave frequency crosstalk model of redistribution line patterns on wafer level package Sung, M.; Kim, N.; Lee, J.; Choi, B.; Park, I.; Hong, J.-K.; Kwon, Y.; et al, IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging, pp.109 - 112, IEEE, 2001-10-29 |
| Microwave Frequency Dielectric Constant and Loss Tangent Measurements of PCB materials Using Stripline Structure Kim, Joungho; Kim, Jingook; Lee, Junho; Kim, Namhoon; Lee, Junwoo, APACK2001, 2001 |
| Microwave Frequency Model of Flip-Chip interconnects using Anisotripic Conductive Film Kim, Joungho, HDP/MCM conference, 1999 |
| Microwave frequency model of flip-chip interconnects using anisotropic conductive film Ryu, Woong Hwan; Yim, Myung-Jin; Lee, Junho; Jeon, Young-Doo; Ahn, Seung Young; Yun, Young-Hwan; Ham, Seog-Heon; et al, Proceedings of the 1999 International Conference on High Density Packaging and MCMs, pp.311 - 315, SPIE, 1999-04-06 |
| Microwave frequency model of water level package and increased loading effect on rambus memory module Lee, J.; Choi, B.; Ahn, S.; Ryu, W.; Kim, J.M.; Choi, K.S.; Hong, J.-K.; et al, 51st Electronic Components and Technology Conference, pp.128 - 132, 2001-05-29 |
| Microwave Imaging by Using a New Hybrid Algorithm Combined by Simulated Annealing and Gradient Algorithms Ra, Jung Woong, Asia-Pacific Microwave Conference, pp.395 - 398, 1995 |
| Microwave Imaging of a Perfectly Conducting Cylinder by Using the Angular Spectrum of the Scattered Fields Ra, Jung Woong, Asia-Pacific Microwave Conference, pp.1205 - 1208, 1994 |
| Microwave Measurement of the Dielectric Constant of BST Films Lee, Hee Chul, pp.0 - 0, 1996-04-01 |
| Microwave Model of Anisotropic Conductive Adhesive Flip-Chip Interconnections for High Frequency Applications Kim, Joungho; Paik, Kyung-Wook; Yim, M; Ryu, W; Jeon, Y, Electronic Components and Technology Conference, Electronic Components and Technology Conference, 1999-05 |
| Microwave Research Activities in Korea Ra, Jung Woong, Asia-Pacific Microwave Conference, 1990 |
| MiDaS: Representative Sampling from Real-world Hypergraphs Choe, Min Young; Yoo, Jaemin; Lee, Geon; Baek, Woonsung; Kang, U; Shin, Kijung, 31st ACM World Wide Web Conference, WWW 2022, pp.1080 - 1092, Association for Computing Machinery, Inc, 2022-04-25 |
| Middle layer incorporating software robot and mobile robot Kim, T.-H.; Choi, S.-H.; Kim, Jong-Hwan, 2006 IEEE International Conference on Systems, Man and Cybernetics, pp.253 - 259, IEEE, 2006-10-08 |
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