Microwave frequency crosstalk model of redistribution line patterns of wafer level package

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Publisher
IEEE
Issue Date
2001-10-29
Language
ENG
Citation

IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging, pp.109 - 112

URI
http://hdl.handle.net/10203/125735
Appears in Collection
EE-Conference Papers(학술회의논문)
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