Showing results 12181 to 12240 of 14432
Thermal and chemical stability of reflowed-photoresist microlenses Han, MG; Park, YJ; Kim, SH; Yoo, BS; Park, HyoHoon, JOURNAL OF MICROMECHANICS AND MICROENGINEERING, v.14, no.3, pp.398 - 402, 2004-03 |
Thermal and Signal Integrity Co-Design and Verification of Embedded Cooling Structure With Thermal Transmission Line for High Bandwidth Memory Module Son, Keeyoung; Kim, Seongguk; Park, Hyunwook; Shin, Taein; Kim, Keunwoo; Kim, Minsu; Sim, Boogyo; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.12, no.9, pp.1542 - 1556, 2022-09 |
Thermal characteristics of InGaP/GaAs HBT ballasted with extended ledge Jeon, S; Park, HM; Hong, Songcheol, IEEE TRANSACTIONS ON ELECTRON DEVICES, v.48, no.10, pp.2442 - 2445, 2001-10 |
Thermal Conductivity and Thermal Boundary Resistances of ALD Al2O3 Films on Si and Sapphire Lee, Seung-Min; Choi, Won Chul; Kim, Junsoo; Kim, Taekwang; Lee, Jaewoo; Im, Sol Yee; Kwon, Jung Yoon; et al, INTERNATIONAL JOURNAL OF THERMOPHYSICS, v.38, no.176, 2017-12 |
Thermal diffusion barrier metallization based on Co-Mo powder-mixed composites for n-type skutterudite ((Mm,Sm)(y)Co4Sb12) thermoelectric devices Song, Jinseop; Kim, Yeongseon; Cho, Byung Jin; Yoo, Chung-Yul; Yoon, Hana; Park, Sang Hyun, JOURNAL OF ALLOYS AND COMPOUNDS, v.818, 2020-03 |
Thermal display glove for interacting with virtual reality Kim, Seung-Won; Kim, Sung Hee; Kim, Choong Sun; Yi, Kyoungsoo; Kim, Jun-Sik; Cho, Byung Jin; Cha, Youngsu, SCIENTIFIC REPORTS, v.10, no.1, 2020-07 |
Thermal effect analysis on crosstalk and performance of optoelectronic transmitter modules for optical interconnects Ukaegbu, Ikechi Augustine; Uddin, M. Rakib; Sangirov, Jamshid; Nguyen, Nga T. H.; Lee, Tae-Woo; Cho, Mu Hee; Park, Hyo-Hoon, OPTICAL AND QUANTUM ELECTRONICS, v.49, no.8, 2017-08 |
Thermal instability of effective work function in metal/high-kappa stack and its material dependence Joo, MS; Cho, Byung Jin; Balasubramanian, N; Kwong, DL, IEEE ELECTRON DEVICE LETTERS, v.25, no.11, pp.716 - 718, 2004-11 |
Thermal issues in 3D IC 신인섭; 김상민; 백승훈; 서문준; 유리은; 신영수, 전자공학회지, v.36, no.9, pp.980 - 990, 2009-09 |
Thermal modeling of heterojunction bipolar transistors with pulsed I-V measurements Park, Hyun-Min; Jeon, Kye-Ik; Hong, Songcheol, MICROWAVE JOURNAL, v.44, no.3, pp.128 - 128, 2001-03 |
Thermal Runaway of Silicon-Based Laser Sails Holdman, Gregory R.; Jaffe, Gabriel R.; Feng, Demeng; Jang, Min Seok; Kats, Mikhail A.; Brar, Victor W., ADVANCED OPTICAL MATERIALS, v.10, no.19, 2022-07 |
THERMAL STABILITIES AND MICROSTRUCTURES OF TUNGSTEN COMPOUND CONTACTS ON N-GAAS FABRICATED BY LOW-ENERGY ION-BEAM-ASSISTED DEPOSITION Park, Chul Soon; Lee, JS; Kang, JY; Lee, Jeong Yong, APPLIED PHYSICS LETTERS, v.59, no.14, pp.1767 - 1769, 1991-09 |
Thermal Stability and Memory Characteristics of HfON Trapping Layer for Flash Memory Device Applications Jeon, Sanghun, ELECTROCHEMICAL AND SOLID STATE LETTERS, v.12, no.11, pp.H412 - H415, 2009 |
Thermal stability of (HfO2)(x)(Al2O3)(1-x) on Si Yu, HY; Wu, N; Li, MF; Zhu, CX; Cho, Byung Jin; Kwong, DL; Tung, CH; et al, APPLIED PHYSICS LETTERS, v.81, no.19, pp.3618 - 3620, 2002-11 |
Thermal Stability of ALD-HfO(2)/GaAs Pretreated with Trimethylaluminium Byun, YC (Byun, Young-Chul); An, CH (An, Chee-Hong); Lee, Seok-Hee; Cho, MH (Cho, Mann-Ho); Kim, H (Kim, Hyoungsub), JOURNAL OF THE ELECTROCHEMICAL SOCIETY, v.159, no.1, pp.6 - 10, 2012 |
Thermal stability study of Si cap/ultrathin Ge/Si and strained Si/Si1-xGex/Si nMOSFETs with HfO2 gate dielectric Yeo, CC; Cho, Byung Jin; Lee, MH; Liu, CW; Choi, KJ; Lee, TW, SEMICONDUCTOR SCIENCE AND TECHNOLOGY, v.21, no.5, pp.665 - 669, 2006-05 |
Thermal Studies of 3-D Stacked InGaAs HEMTs and Mitigation Strategy of Self-Heating Effect Using Buried Metal Insertion Jeong, Jaeyong; Kim, Seongkwang; Suh, Yoonje; Shim, Joonsup; Beak, Woo Jin; Choi, Sung Joon; Kim, Joon Pyo; et al, IEEE TRANSACTIONS ON ELECTRON DEVICES, 2024-06 |
Thermal transport properties of thin films of small molecule organic semiconductors Kim, N; Domercq, B; Yoo, Seunghyup; Christensen, A; Kippelen, B; Graham, S, APPLIED PHYSICS LETTERS, v.87, no.24, 2005-12 |
Thermal-Variation Insensitive Force-Touch Sensing System Using Transparent Piezoelectric Thin-Film Kim, Min-Woo; Kim, Dong-Kyu; Kodani, Tetsuhiro; Kanemura, Takashi; Gwon, Hui Dong; Cho, Gyu-Hyeong; Han, Kwan-Young; et al, IEEE SENSORS JOURNAL, v.18, no.14, pp.5863 - 5875, 2018-07 |
Thermally assisted quantum vortex tunneling in the Hall and dissipative regime Kim, GH; Shin, Mincheol, PHYSICAL REVIEW B, v.66, no.6, 2002-08 |
Thermally grown thin nitride films as a gate dielectric Shin, H; Choi, S; Hwang, T; Lee, Kwyro, JOURNAL OF THE KOREAN PHYSICAL SOCIETY, v.33, pp.175 - 178, 1998-11 |
Thermally stable fully silicided Hf-silicide metal-gate electrode Park, CS; Cho, Byung Jin; Kwong, DL, IEEE ELECTRON DEVICE LETTERS, v.25, no.6, pp.372 - 374, 2004-06 |
Thermally stable optical characteristics of sol-gel hybrid material films Moujoud, A; Kim, WS; Bae, Byeong-Soo; Shin, Sang Yung, APPLIED PHYSICS LETTERS, v.88, no.10, pp.228 - 236, 2006-03 |
Thermally Stable Single-Transistor Neuron for Reliable Neuromorphic System Chung, Young-Woo; Han, Joon-Kyu; Jung, Jin-Woo; Yun, Seong-Yun; Yu, Jiman; Lee, Mun-Woo; Choi, Yang-Kyu, IEEE ELECTRON DEVICE LETTERS, v.43, no.11, pp.1806 - 1809, 2022-11 |
Thermally stable structure of InGaP/GaAs Hetero-junction Bipolar Transistor: Dual-emitter structure Lee, You Sang; Park, Chul Soon, JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES REVIEW PAPERS, v.41, no.4B, pp.2658 - 2659, 2002-04 |
Thermally Tuning Infrared Light Scattering Using Planar Layered Thin Films and Space Gradient Metasurface Kocer, Hasan; Ozer, Ahmet; Butun, Serkan; Wang, Kevin; Wu, Junqiao; Kurt, Hamza; Aydin, Koray, IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS, v.25, no.3, 2019-05 |
Thermistor behavior of PEDOT:PSS thin film Kwon, Il-Woong; Son, Hyuck-Jun; Kim, Woo-Young; Lee, Yong-Soo; Lee, Hee-Chul, SYNTHETIC METALS, v.159, no.12, pp.1174 - 1177, 2009-06 |
Thermo-optic control of the longitudinal radiation angle in a silicon-based optical phased array Kim, Seong-Hwan; You, Jong-Bum; Ha, Yungi; Kang, Geumbong; Lee, Daeseong; Yun, Hyunho; Yoo, Dong-Eun; et al, OPTICS LETTERS, v.44, no.2, pp.411 - 414, 2019-01 |
Thermoelectric characteristics of Pt-silicide/silicon multi-layer structured p-type silicon Choi, Won Chul; Jun, Dongseok; Kim, Soojung; Shin, Min-Cheol; Jang, Moongyu, ENERGY, v.82, pp.180 - 183, 2015-03 |
Thermoelectric properties of P-type Sb2Te3 thick film processed by a screen-printing technique and a subsequent annealing process Kim, Sun Jin; We, Ju Hyung; Kim, Jin Sang; Kim, Gyung Soo; Cho, Byung Jin, JOURNAL OF ALLOYS AND COMPOUNDS, v.582, pp.177 - 180, 2014-01 |
Thermoelectric properties of screen-printed ZnSb film Lee, Heon Bok; We, Ju Hyung; Yang, Hyun Jeong; Kim, Kukjoo; Choi, Kyung Cheol; Cho, Byung Jin, THIN SOLID FILMS, v.519, no.16, pp.5441 - 5443, 2011-06 |
Thermofluorescent Conjugated Polymer Sensors for Nano- and Microscale Temperature Monitoring Yarimaga, Oktay; Lee, Su-Mi; Ham, Dae-Young; Choi, Ji-Min; Kwon, Soon-Gyu; Im, Mae-Soon; Kim, Sung-Ho; et al, MACROMOLECULAR CHEMISTRY AND PHYSICS, v.212, no.12, pp.1211 - 1220, 2011-06 |
Thermooptic 2x2 asymmetric digital opticat switches with zero-voltage operation state Noh, YO; Kim, JM; Yang, MS; Choi, HJ; Lee, HJ; Won, YH; Han, SG, IEEE PHOTONICS TECHNOLOGY LETTERS, v.16, no.2, pp.446 - 448, 2004-02 |
Thick-Copper-Buried Inductors Using Anodized Aluminum Package Substrates Kim, Cheol Ho; Kwon, Young-Se, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.2, no.8, pp.1260 - 1264, 2012-08 |
Thickness dependent low-frequency noise characteristics of a-InZnO thin-film transistors under light illumination Choi, Hyun-Sik; Jeon, Sanghun, APPLIED PHYSICS LETTERS, v.104, no.2, 2014-01 |
THICKNESS UNIFORMITY AND ELECTRICAL-PROPERTIES OF ULTRATHIN GATE OXIDES GROWN IN N2O AMBIENT BY RAPID THERMAL-PROCESSING Yoon, Giwan; JOSHI, AB; AHN, J; KWONG, DL, JOURNAL OF APPLIED PHYSICS, v.72, no.12, pp.5706 - 5710, 1992-12 |
Thienothiophenyl-Isoquinoline Iridium Complex-Based Deep Red to Near-Infrared Organic Light-Emitting Diodes with Low Driving Voltage and High Radiant Emittance for Practical Biomedical Applications Park, Yongjin; Lee, Gyeong Seok; Choi, Hye-Ryung; Jeon, Yongmin; Jeong, So Yeong; Noh, Byeongju; Park, Kyoung-Chan; et al, Advanced Photonics Research, v.2, no.10, pp.2100121, 2021-10 |
Thin Film Bulk Acoustic Resonators for RF Applications Linh Mai; Jae-Young Lee; 윤기완, 국제해양정보통신학회영문논문지, v.4, no.3, pp.111 - 113, 2006-09 |
Thin film encapsulation for organic light emitting diodes using a multi-barrier composed of MgO prepared by atomic layer deposition and hybrid materials Kim, Eungtaek; Han, Yuncheol; Kim, Woohyun; Choi, Kyung Cheol; Im, Hyeon-Gyun; Bae, Byeong-Soo, ORGANIC ELECTRONICS, v.14, no.7, pp.1737 - 1743, 2013-07 |
Thin film solar cells on honeycomb-structured substrates for photovoltaic building blocks Baik, Seung Jae; Lee, Yong-Min; Lim, Koeng Su; Kim, Keun-Taek, RENEWABLE ENERGY, v.64, pp.98 - 104, 2014-04 |
Thin Hybrid Metamaterial Slab With Negative and Zero Permeability for High Efficiency and Low Electromagnetic Field in Wireless Power Transfer Systems Cho, Yeonje; Lee, Seongsoo; Kim, Dong-Hyun; Kim, Hongseok; Song, Chiuk; Kong, Sunkyu; Park, Junyong; et al, IEEE Transactions on Electromagnetic Compatibility, v.60, no.4, pp.1001 - 1009, 2018-08 |
Thin Ion-Gel Dielectric Layer to Enhance the Stability of Polymer Transistors Lee, Sung Won; Shin, Minkwan; Park, Jae Yoon; Kim, Bong Soo; Tu, Deyu; Jeon, Sanghun; Jeong, Unyong, SCIENCE OF ADVANCED MATERIALS, v.7, no.5, pp.874 - 880, 2015-05 |
Thin Metallic Heat Sink for Interfacial Thermal Management in Biointegrated Optoelectronic Devices Jung H.H.; Song J.; Nie S.; Jung H.N.; Kim M.S.; Jeong, Jae-Woong; Song Y.M.; et al, Advanced Materials Technologies, v.3, no.11, 2018-11 |
Thin PCB-Type Metamaterials for Improved Efficiency and Reduced EMF Leakage in Wireless Power Transfer Systems Cho, Yeonje; Kim, Jonghoon; Kim, DongHyun; Lee, Seongsoo; Kim, Hongseok; Song, Chiuk; Kong, Sunkyu; et al, IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, v.64, no.2, pp.353 - 364, 2016-02 |
Thin-Film Thermoelectric Module for Power Generator Applications Using a Screen-Printing Method Lee, Heon-Bok; Yang, Hyun Jeong; We, Ju Hyung; Kim, Kukjoo; Choi, Kyung Cheol; Cho, Byung Jin, JOURNAL OF ELECTRONIC MATERIALS, v.40, no.5, pp.615 - 619, 2011-05 |
Thin-film transistor-driven vertically stacked full-color organic light-emitting diodes for high-resolution active-matrix displays Choi, Sukyung; Kang, Chan-mo; Byun, Chun-Won; Cho, Hyunsu; Kwon, Byoung-Hwa; Han, Jun-Han; Yang, Jong-Heon; et al, NATURE COMMUNICATIONS, v.11, no.1, 2020-06 |
Three Phase Resonant Pole Inverter Using a New Sepa Sated Soft Switching Resonant Pole J.G.Cho; D.Y.Hu; G.H.Cho, 전기학회논문지, v.4, no.2, pp.90 - 97, 1991 |
Three phase three-level PWM switched voltage source inverter with zero neutral point potential Oh, Won-Sik; Han, Sang-Kyoo; Choi, Seong-Wook; Moon, GunWoo, IEEE TRANSACTIONS ON POWER ELECTRONICS, v.21, no.5, pp.1320 - 1326, 2006-09 |
Three-Dimensional Blood Vessel Quantification via Centerline Deformation Kang, Dong-Goo; Suh, Dae Chul; Ra, Jong Beom, IEEE TRANSACTIONS ON MEDICAL IMAGING, v.28, pp.405 - 414, 2009-03 |
Three-dimensional electro-floating display system using an integral imaging method Min, SW; Hahn, Minsoo; Kim, J; Lee, B, OPTICS EXPRESS, v.13, pp.4358 - 4369, 2005-06 |
Three-Dimensional Fin-Structured Semiconducting Carbon Nanotube Network Transistor Lee, Dong-Il; Lee, Byung-Hyun; Yoon, Jinsu; Ahn, Dae-Chul; Park, Jun-Young; Hur, Jae; Kim, Myung-Su; et al, ACS NANO, v.10, no.12, pp.10894 - 10900, 2016-12 |
Three-dimensional fluorescence microscopy through virtual refocusing using a recursive light propagation network Shin, Changyeop; Ryu, Hyun; Cho, Eun-Seo; Han, Seungjae; Lee, Kang-Han; Kim, Cheol-Hee; Yoon, Young-Gyu, MEDICAL IMAGE ANALYSIS, v.82, 2022-11 |
Three-Dimensional Integration Approach to High-Density Memory Devices Kim, Hojung; Jeon, Sanghun; Lee, Myoung-Jae; Park, Jaechul; Kang, Sangbeom; Choi, Hyun-Sik; Park, Churoo; et al, IEEE TRANSACTIONS ON ELECTRON DEVICES, v.58, no.11, pp.3820 - 3828, 2011-11 |
Three-dimensional interconnect for multilayer module packages with selectively anodised aluminium substrate Yeo, S. K.; Kwon, Young Se, ELECTRONICS LETTERS, v.45, no.13, pp.678 - 680, 2009-06 |
Three-dimensional nanopillar-array photovoltaics on low-cost and flexible substrates Fan, Zhiyong; Razavi, Haleh; Do, Jae-won; Moriwaki, Aimee; Ergen, Onur; Chueh, Yu-Lun; Leu, Paul W.; et al, NATURE MATERIALS, v.8, no.8, pp.648 - 653, 2009-08 |
Three-dimensional quantum simulation of multigate nanowire field effect transistors Shin, Mincheol, MATHEMATICS AND COMPUTERS IN SIMULATION, v.79, no.4, pp.1060 - 1070, 2008-12 |
Three-dimensional solar steam generation device with additional non-photothermal evaporation Kim, Kwanghyun; Yu, Sunyoung; Kang, Se-Young; Ryu, Seung-Tak; Jang, Ji-Hyun, DESALINATION, v.469, 2019-11 |
Three-dimensional, multifunctional neural interfaces for cortical spheroids and engineered assembloids Park, Yoonseok; Franz, Colin K.; Ryu, Hanjun; Luan, Haiwen; Cotton, Kristen Y.; Kim, Jong Uk; Chung, Ted S.; et al, SCIENCE ADVANCES, v.7, no.12, 2021-03 |
Three-dimensionally patterned Ag-Pt alloy catalyst on planar Si photocathodes for photoelectrochemical H-2 evolution Lim, Sung Yul; Ha, Kyungyeon; Ha, Heonhak; Lee, Soo Youn; Jang, Min Seok; Choi, Mansoo; Chung, Taek Dong, PHYSICAL CHEMISTRY CHEMICAL PHYSICS, v.21, no.8, pp.4184 - 4192, 2019-01 |
Three-Electrode Metal-Oxide Gas Sensor System With CMOS Interface IC Park, Jeong Ho; Park, Kwang Min; Kim, Tae-Wan; Shin, Seongheon; Park, Chong-Ook; Yoo, Hyung-Joun, IEEE SENSORS JOURNAL, v.17, no.3, pp.784 - 793, 2017-02 |
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