Browse "School of Electrical Engineering(전기및전자공학부)" by Type Conference
Showing results 12561 to 12580 of 22768
| Modeling of a Multimachine Power System and Design of a Robust Adaptive Power System Stabilizer Shin, Jin-Ho; Lee, Ju-Jang, KIEE Tajoen Branch Conference, pp.43 - 49, KIEE, 1998-12 |
| Modeling of an Elastomer Constitutive Relation 성단근, 한국자동제어학술회의, pp.1018 - 1021, 1988-12 |
| Modeling of Chip Level Power Distribution Network Based on Segmentation Method Kim, Joungho; Kim, Jaemin; Shim, Yujeong; Song, Eakhwan; Koo, Kyungchul, International Workshop on Electromagnetic Compatibility of Integrated Circuits, 2007 |
| Modeling of Chip-Package-PCB Hierarchical Power Distribution Network based on Segmentation Method Kim, Jaemin; Shim, Jongjoo; Pak, Junso; Kim, Joungho, Electrical Design of Advanced Packaging and Systems Symposium, 2008. EDAPS 2008., pp.85 - 88, IEEE, 2008-12-11 |
| Modeling of Current Degradation in Hot-Eletron Damaged LDD NMOSFETs Ytterdal, T.; Kim, S-H.; Min, K-S.; Lee, Kwyro; Fjeldly, T.A., 2nd Int. Device Reseach Symposium, pp.261 - 264, 2nd Int. Device Reseach Symposium, 1993-12 |
| Modeling of eigenvalues for MIMO channel capacity based on outdoor measurements Kim, W.; Lee, HyuckJae; Park, J.J.; Kim, M.-D.; Chung, H.K., VTC Spring 2009 - IEEE 69th Vehicular Technology Conference, pp.1 - 5, IEEE, 2009-04-26 |
| Modeling of Electromagnetic Interference Shielding Materials in Wireless Power Transfer for Board-to-Board Level Interconnections 김정호; 김석진; 정현석; 김종훈; 배범희; 공선규; 송치억, IEEE Wireless Power Transfer Conference 2014(WPTC2014), IEEE Wireless Power Transfer Conference 2014(WPTC2014), 2014-05-08 |
| Modeling of Frame Difference Image Based on Ridge-signal and Application to Low-rate Video Data Compression Kim, Seong-Dae; Jang, SH, Proceeding of ISITA, pp.547 - 550, 1990 |
| Modeling of hierarchical power/ground network based on segmentation method for package/board co-design and simulation Kim, J.; Jeong, Y.; Kim, J.; Lee, J.; Shim, J.; Kim, Joungho, 2006 IEEE International Symposium on Electromagnetic Compatibility, EMC 2006, pp.16 - 19, IEEE, 2006-08-14 |
| Modeling of Interaction with the Environment Using Sensor Inputs in Human-friendly Software Robot Lee, Joon-Yong; Kim, Chang-Hyun; Lee, Ju-Jang, KACC, pp.582 - 585, KACC, 2005-10 |
| Modeling of Interconnected Multimachine Power System with a Generator-Exciter System Shin, J.H.; Lee, Ju-Jang, Conf. on KIEE Tadjon, pp.3 - 13, KIEE, 1996-12 |
| Modeling of Power Consumption for Macro-, Micro-, and RRH-based Base Station Architectures Jung, BH; Sung, Dan Keun, IEEE VTC 2014 Spring, IEEE VT Society, 2014-05-20 |
| MODELING OF QUANTUM PARALLEL RESONANT CONVERTERS - A NEW PARALLEL RESONANT CONVERTERS CONTROLLED BY INTEGRAL CYCLE MODE Jeong, gyu bum; Cho, Gyu-Hyeong, Power Electronics Specialists Conference, 1989. PESC '89 Record., 20th Annual IEEE, pp.744 - 751, IEEE, 1989-06 |
| Modeling of quantum series resonant converters - controlled by integral cycle mode Joung, G.B.; Rim, Chuntaek; Cho, Gyu-Hyeong, Conference Record of the 1988 IEEE Industry Applications Society Annual Meeting, pp.821 - 826, 1988-10 |
| Modeling of Simultaneous Switching Noise Effects on Jitter Characteristics of Delay Locked Loop in a Hierarchical System of Chip-Package-PCB Shim, Yujeong; Bae, Bumhee; Koo, Koungchoul; Kim, Joungho, 8th International Workshop on Electromagnetic Compatibility of Integrated Circuits, EMC Compo 2011, 2011-11-07 |
| Modeling of terminal mobility to evaluate the number of location updates Chung, Min Young; Kim, Tai Suk; Cho, Ho Shin; Sung, Dan Keun, Proceedings of the 1997 IEEE International Conference on Communications, ICC. Part 3 (of 3), v.3, pp.1266 - 1270, 1997-06-08 |
| Modeling of the Emotional Model with Friendship for Familiarity of Robot Choi, Tae-Yong; Lee, Joon-Yong; Shin, Jin-Ho; Lee, Ju-Jang, IEEE IRS/RSJ International Conference on Intelligent Robots and Systems, pp.2437 - 2442, IEEE, 2005-08-02 |
| Modeling of Thermal Conductivity Extraction of Thin Film Thermoelectric Materials Using a Screen Printing Technique We, Ju Hyung; Kim, Sun Jin; Cho, Byung Jin, 6th Annual Energy Harvesting Workshop, 2011-08 |
| Modeling of Through-silicon Via (TSV) with an hmbedded High-density Metal-insulator-metal (MIM) Capacitor Cho, Kyunjun; Kim, Youngwoo; Kim, Subin; Park, Gapyeol; Son, Kyungjune; Park, Hyunwook; Kim, Seongguk; et al, IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), IEEE, 2018-12 |
| Modeling Photo Composition and Its Application to Photo Re-arrangement Kweon, In-So; Park, Jaesik; Lee, Joon-Young; Tai, Yu-Wing, IEEE International Conference on Image Processing, IEEE, 2012-10 |
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