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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Journal Papers(저널논문)

Brittle Failure and Effect of Thermal Aging on Pb-free Solder Flip Chip Using Electroless Ni-P UBM

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Kwon,Yong-Min / Jeon,Young-Doo / Paik, Kyung-Wook researcher / Kin, Jung-Do / Lee, Jin-Woo

Publisher: KOREAN INST METALS MATERIALS

Issue Date: 2006-03

Language: English

Article Type: Article

Citation: ELECTRONIC MATERIALS LETTERS, v.2, no.1, pp.37 - 42

ISSN: 1738-8090

URI: http://hdl.handle.net/10203/194557

Appears in Collection: MS-Journal Papers(저널논문)

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