Brittle Failure and Effect of Thermal Aging on Pb-free Solder Flip Chip Using Electroless Ni-P UBM
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Kwon,Yong-Min | ko |
| dc.contributor.author | Jeon,Young-Doo | ko |
| dc.contributor.author | Paik, Kyung-Wook | ko |
| dc.contributor.author | Kin, Jung-Do | ko |
| dc.contributor.author | Lee, Jin-Woo | ko |
| dc.date.accessioned | 2015-03-27T08:08:21Z | - |
| dc.date.available | 2015-03-27T08:08:21Z | - |
| dc.date.created | 2015-01-08 | - |
| dc.date.created | 2015-01-08 | - |
| dc.date.issued | 2006-03 | - |
| dc.identifier.citation | ELECTRONIC MATERIALS LETTERS, v.2, no.1, pp.37 - 42 | - |
| dc.identifier.issn | 1738-8090 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/194557 | - |
| dc.language | English | - |
| dc.publisher | KOREAN INST METALS MATERIALS | - |
| dc.title | Brittle Failure and Effect of Thermal Aging on Pb-free Solder Flip Chip Using Electroless Ni-P UBM | - |
| dc.type | Article | - |
| dc.identifier.wosid | 000208605100008 | - |
| dc.type.rims | ART | - |
| dc.citation.volume | 2 | - |
| dc.citation.issue | 1 | - |
| dc.citation.beginningpage | 37 | - |
| dc.citation.endingpage | 42 | - |
| dc.citation.publicationname | ELECTRONIC MATERIALS LETTERS | - |
| dc.contributor.localauthor | Paik, Kyung-Wook | - |
| dc.contributor.nonIdAuthor | Kwon,Yong-Min | - |
| dc.contributor.nonIdAuthor | Jeon,Young-Doo | - |
| dc.contributor.nonIdAuthor | Kin, Jung-Do | - |
| dc.contributor.nonIdAuthor | Lee, Jin-Woo | - |
| dc.type.journalArticle | Article | - |
| dc.subject.keywordAuthor | electroless Ni-P | - |
| dc.subject.keywordAuthor | Pb-free | - |
| dc.subject.keywordAuthor | brittle failure | - |
| dc.subject.keywordAuthor | reliability | - |
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