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1
A Novel Double Layer NCF for Highly Reliable Micro-Bump　Interconnection

Shin, Ji-Won; Choi, Yong-Won; Kim, Young Soon; Kang, Un Byung; Seo, Sun Kyung; Paik, Kyung-Wook, The 64th Electronic Components and Technology Conference, The 64th Electronic Components and Technology Conference, 2014-05-28

2
A Novel Fine Pitch TSV Interconnection Method Using NCF with Zn Nano -particles

Shin, Ji-Won; Choi, Yong-Won; Kim, Young Soon; Kang, Un Byung; Seo, Sun Kyung; Paik, Kyung-Wook, The 64th Electronic Components and Technology Conference, The 64th Electronic Components and Technology Conference, 2014-05-28

3
A Study on the Fine Pitch Chip Interconnection Using Cu/SnAg Bumps and B-stage Non-conductive　Films (NCFs) for 3D-TSV Vertical　Interconnection

Choi, Yong-Won; Shin, Ji-Won; Kim, Young Soon; Suk, Kyung-lim; Kim, Il; Paik, Kyung-Wook, The 64th Electronic Components and Technology Conference, The 64th Electronic Components and Technology Conference, 2014-05-28

4
(A) study on interfacial reactions of Pd added ultra-fine Au bonding wires and Al pads = 팔라듐이 첨가된 초 미세직경 금 본딩 와이어와 알루미늄 패드의 계면 반응에 대한 연구link

Shin, Ji-Won; 신지원; et al, 한국과학기술원, 2010

5
Development of Anhydride-based NCFs for Cu/Sn-Ag Eutectic Bonding and Process Optimization for Fine Pitch TSV Chip Stacking

Shin, Ji-Won; Choi, Yong-Won; Kim, Young Soon; Kang, Un Byung; Jee, Young Kun; Hwang, Ji Hwan; Paik, Kyung-Wook, The 62nd Electronic Components and Technology Conference, IEEE, 2012-05

6
Effect of NCFs with Zn-nanoparticles on the Interfacial Reactions of 40 um Pitch Cu pillar/Sn-Ag Bump for TSV Interconnection

Shin, Ji-Won; Choi, Yong-Won; Kim, Young Soon; Kim, Un Byung; Jee, Young Kun; Paik, Kyung-Wook, The 63rd Electronic Components and Technology Conference, pp.1024 - 1030, The 63rd Electronic Components and Technology Conference, 2013-05-30

7
Effects of Pad Surface Finish on Interfacial Reliabilities of　Cu-Pillar/Sn-Ag Bumps　of 2.5D TSV-Enterposer on PCB Applications

Kim, Young Soon; Shin, Ji-Won; Choi, Yong-Won; Paik, Kyung-Wook, The 64th Electronic Components and Technology Conference, The 64th Electronic Components and Technology Conference, 2014-05-28

8
Effects of Thermo-compression Bonding Parameters on Joint Formation of Micro-bumps in Non-conductive Film (NCF)

Shin, Ji-Won; Kim, Young Soon; Lee, Hyoung Gi; Kang, Un Byung; Seo, Sun Kyung; Paik, Kyung-Wook, 65th Electronic Components and Technology Conference, IEEE Electronic Components and Technology Conference, 2015-05-28

9
Fine pitch chip on board (CoB) bonding using B-stage non-conductive film (NCF) for 3D TSV vertical interconnection

Choi, Yongwon; Shin, Ji-Won; Kim, Il; Kim, Young-soon; Paik, Kyung-Wook, 15th IEEE International Symposium and Exhibition on Advanced Packaging Materials (APM 2013) , pp.186 - 191, 15th IEEE International Symposium and Exhibition on Advanced Packaging Materials (APM 2013), 2013-02-27

10
Reliability Improvement Methods of Solder Anisotropic Conductive Film (ACF) Joints　Using Morphology Control of Solder ACF Joints

Kim, Yoo-Sun; Kim, Seung-Ho; Shin, Ji-Won; Paik, Kyung-Wook, The 64th Electronic Components and Technology Conference, The 64th Electronic Components and Technology Conference, 2014-05-29

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