DSpace at KOASAS: Fine pitch chip on board (CoB) bonding using B-stage non-conductive film (NCF) for 3D TSV vertical interconnection

DSpace at KOASAS

College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

Fine pitch chip on board (CoB) bonding using B-stage non-conductive film (NCF) for 3D TSV vertical interconnection

Cited 0 time in webofscience

Cited 0 time in

Hit : 270
Download : 0

Export

Choi, Yongwon / Shin, Ji-Won / Kim, Il / Kim, Young-soon / Paik, Kyung-Wook researcher

Publisher: 15th IEEE International Symposium and Exhibition on Advanced Packaging Materials (APM 2013)

Issue Date: 2013-02-27

Language: English

Citation: 15th IEEE International Symposium and Exhibition on Advanced Packaging Materials (APM 2013) , pp.186 - 191

URI: http://hdl.handle.net/10203/194789

Appears in Collection: MS-Conference Papers(학술회의논문)

Files in This Item: There are no files associated with this item.

Display Full Item Record

qr_code

트윗하기

KOASAS

Knowledge Service Development Team, KAIST 291 Daehak-ro, Yuseong-gu, Daejeon 34141, Republic of Korea. T. 82-42-350-4493 Email. koasas@kaist.ac.kr
Copyright © 2016. Korea Advanced Institute of Science and Technology. All Rights Reserved.

KOASAS

KOASAS

Browse

Fine pitch chip on board (CoB) bonding using B-stage non-conductive film (NCF) for 3D TSV vertical interconnection

KOASAS

Communities & Collections