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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

Fine pitch chip on board (CoB) bonding using B-stage non-conductive film (NCF) for 3D TSV vertical interconnection

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dc.contributor.authorChoi, Yongwonko
dc.contributor.authorShin, Ji-Wonko
dc.contributor.authorKim, Ilko
dc.contributor.authorKim, Young-soonko
dc.contributor.authorPaik, Kyung-Wookko
dc.date.accessioned2015-04-06T06:14:54Z-
dc.date.available2015-04-06T06:14:54Z-
dc.date.created2015-01-15-
dc.date.created2015-01-15-
dc.date.issued2013-02-27-
dc.identifier.citation15th IEEE International Symposium and Exhibition on Advanced Packaging Materials (APM 2013) , pp.186 - 191-
dc.identifier.urihttp://hdl.handle.net/10203/194789-
dc.languageEnglish-
dc.publisher15th IEEE International Symposium and Exhibition on Advanced Packaging Materials (APM 2013)-
dc.titleFine pitch chip on board (CoB) bonding using B-stage non-conductive film (NCF) for 3D TSV vertical interconnection-
dc.typeConference-
dc.identifier.wosid000320594100022-
dc.identifier.scopusid2-s2.0-84878859273-
dc.type.rimsCONF-
dc.citation.beginningpage186-
dc.citation.endingpage191-
dc.citation.publicationname15th IEEE International Symposium and Exhibition on Advanced Packaging Materials (APM 2013)-
dc.identifier.conferencecountryUS-
dc.contributor.localauthorPaik, Kyung-Wook-
dc.contributor.nonIdAuthorChoi, Yongwon-
dc.contributor.nonIdAuthorShin, Ji-Won-
dc.contributor.nonIdAuthorKim, Il-
dc.contributor.nonIdAuthorKim, Young-soon-
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MS-Conference Papers(학술회의논문)
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