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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

Effects of Thermo-compression Bonding Parameters on Joint Formation of Micro-bumps in Non-conductive Film (NCF)

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Shin, Ji-Won / Kim, Young Soon / Lee, Hyoung Gi / Kang, Un Byung / Seo, Sun Kyung / Paik, Kyung-Wookresearcher
Publisher
IEEE Electronic Components and Technology Conference
Issue Date
2015-05-28
Language
English
Citation

65th Electronic Components and Technology Conference

URI
http://hdl.handle.net/10203/225014
Appears in Collection
MS-Conference Papers(학술회의논문)
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