Effect of NCFs with Zn-nanoparticles on the Interfacial Reactions of 40 um Pitch Cu pillar/Sn-Ag Bump for TSV Interconnection
- Issue Date
- 2013-05-30
- Language
- English
- Citation
The 63rd Electronic Components and Technology Conference, pp.1024 - 1030
- Appears in Collection
- MS-Conference Papers(학술회의논문)
- Files in This Item
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.