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Showing results 1 to 19 of 19

1
Degradation mechanism and reliability of flip chip interconnects using anisotropic conductive adhesives for high current density packaging applications

Yim, MJ; Kim, HJ; Chung, CK; Paik, Kyung-Wook, IEEE 56th Electronic Components and Technology Conference, pp.338 - 343, IEEE, 2006-05-30

2
Effect of conductive particle properties on the reliability of anisotropic conductive film for Chip-On-Glass (COG) applications

Yim, MJ; Chung, CK; Paik, Kyung-Wook, IEEE 11th International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces, pp.38 - 0, 123, 2006-03-15

3
Effect of conductive particle properties on the reliability of anisotropic conductive film for chip-on-glass applications

Yim, MJ; Chung, CK; Paik, Kyung-Wook, IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, v.30, pp.306 - 312, 2007-10

4
Effects of epoxy and rubber addition on die attach films (DAFs) materials properties

Choi, Y; Jang, KW; Chung, CK; Lee S.; Paik, Kyung-Wook, 59th Electronic Components and Technology Conference, ECTC 2009, pp.1525 - 1530, 123, 2009-05-26

5
Effects of the functional groups of non-conductive films (NCFs) on materials properties and reliability of NCF flip-chip-on-organic boards

Chung, CK; Kwon, WS; Park, JH; Lee, Soon-Bok; Paik, Kyung-Wook, International Symposium on Electronics Materials and Packaging, 2005, v.2005, pp.156 - 161, 2005-12-11

6
Embedded chip-in-flex (cif) packages using wafer level package (WLP) with pre-applied anisotropic conductive films (ACFs)

Suk, KL; Son, HY; Chung, CK; Kim, JD; Lee, JW; Paik, Kyung-Wook, 59th Electronic Components and Technology Conference, ECTC 2009, pp.1741 - 1748, 2009-05-26

7
Material properties of anisotropic conductive films (ACFs) and their flip chip assembly reliability in NAND flash memory applications

Jang, KW; Chung, CK; Lee, WS; Paik, Kyung-Wook, MICROELECTRONICS RELIABILITY, v.48, pp.1052 - 1061, 2008-07

8
Multi-functional epoxy/SrTiO3 ceramic powder Embedded Capacitor Films(ECFs) for organic substrates

Lee, S; Hyun, JG; Chung, CK; Paik, Kyung-Wook, 2006 8th Electronics Packaging Technology Conference, EPTC, pp.549 - 552, 2006-12-06

9
Nanofiber anisotropic conductive adhesives (ACAs) for ultra fine pitch chip-on-film (COF) packaging

Suk, KL; Chung, CK; Paik, Kyung-Wook, 2011 61st Electronic Components and Technology Conference, ECTC 2011, pp.656 - 660, ECTC, 2011-05-31

10
Non-Conductive Films (NCFs) with multi-functional epoxies and silica fillers for reliable NCFs Flip Chip on Organic Boards (FCOB)

Chung, CK; Paik, Kyung-Wook, 57th Electronic Components and Technology Conference 2007, ECTC '07, pp.1831 - 1838, IEEE, 2007-05-29

11
Novel non-conductive films(NCFs) with multi-functional epoxies and silica fillers for reliable NCFs flip-chip-on-organic boards

Chung, CK; Kim, HJ; Paik, Kyung-Wook, 2006 International Conference on Electronic Materials and Packaging, EMAP, 123, 2006-12-11

12
Study on bubble formation in rigid-flexible substrates bonding using Anisotropic Conductive Films (ACFs) and their effects on the ACF joint reliability

Kim, HJ; Chung, CK; Yim, MJ; Hong, SM; Jang, SY; Moon, YJ; Paik, Kyung-Wook, IEEE 56th Electronic Components and Technology Conference, pp.952 - 958, IEEE, 2006-05-30

13
The effects of the degree of cure of anisotropic conductive films (ACFs) on the contraction stress build-up of ACFs and ACF joints stability for ACF FlipChip interconnection

Chung, CK; Paik, Kyung-Wook, 2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008, pp.20 - 24, 123, 2008-10-22

14
The effects of the degree of cure of anisotropic conductive films (ACFs) on the contraction stress build-up of ACFs and ACF joints stability for chip-on-flex (COF) applications

Chung, CK; Paik, Kyung-Wook, 2009 59th Electronic Components and Technology Conference, ECTC 2009, pp.161 - 167, 123, 2009-05-26

15
Theoretical prediction and experimental measurement of the degree-of-cure of Anisotropic Conductive Film (ACF) for Chip-On-Flex (COF) applications

Chung, CK; Kwon, YM; Kim, I; Son, HY; Choo, KS; Kim, SJ; Paik, Kyung-Wook, International Conference on Electronic Materials and Packaging 2007, EMAP 2007, 123, 2007-11-19

16
Wafer level ACA packages and their applications to advanced electronic packaging

Paik, Kyung-Wook; Son, HY; Kim, I; Chung, CK, 10th Electronics Packaging Technology Conference, EPTC 2008, pp.450 - 456, 123, 2008-12-09

17
Wafer level package using pre-applied Anisotropic Conductive Films (ACFs) for flip-chip interconnections

Son, HY; Chung, CK; Yim, MJ; Paik, Kyung-Wook, IEEE 56th Electronic Components and Technology Conference, pp.565 - 569, IEEE, 2006-05-30

18
Wafer level packages (WLPs) using pre-applied anisotropic conductive films (ACFs)

Paik, Kyung-Wook; Son, HY; Chung, CK, Polytronic 2007 - 6th International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, pp.153 - 158, 123, 2007-01-15

19
Wafer-level flip chip packages using preapplied anisotropic conductive films (ACFs)

Son, HY; Chung, CK; Yim, MJ; Hwang, JS; Paik, Kyung-Wook; Jung, GJ; Lee, JK, IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, v.30, no.3, pp.221 - 227, 2007-07

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