Effect of conductive particle properties on the reliability of anisotropic conductive film for Chip-On-Glass (COG) applications

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Publisher
123
Issue Date
2006-03-15
Language
English
Citation

IEEE 11th International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces, pp.38 - 0

URI
http://hdl.handle.net/10203/139614
Appears in Collection
MS-Conference Papers(학술회의논문)
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