Effect of conductive particle properties on the reliability of anisotropic conductive film for Chip-On-Glass (COG) applications
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Yim, MJ | ko |
| dc.contributor.author | Chung, CK | ko |
| dc.contributor.author | Paik, Kyung-Wook | ko |
| dc.date.accessioned | 2013-03-17T04:00:15Z | - |
| dc.date.available | 2013-03-17T04:00:15Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 2006-03-15 | - |
| dc.identifier.citation | IEEE 11th International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces, pp.38 - 0 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/139614 | - |
| dc.language | English | - |
| dc.publisher | 123 | - |
| dc.title | Effect of conductive particle properties on the reliability of anisotropic conductive film for Chip-On-Glass (COG) applications | - |
| dc.type | Conference | - |
| dc.identifier.wosid | 000246173200014 | - |
| dc.identifier.scopusid | 2-s2.0-34249730534 | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 38 | - |
| dc.citation.endingpage | 0 | - |
| dc.citation.publicationname | IEEE 11th International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces | - |
| dc.identifier.conferencecountry | US | - |
| dc.identifier.conferencelocation | Atlanta, GA | - |
| dc.contributor.localauthor | Paik, Kyung-Wook | - |
| dc.contributor.nonIdAuthor | Yim, MJ | - |
| dc.contributor.nonIdAuthor | Chung, CK | - |
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