Effects of the functional groups of non-conductive films (NCFs) on materials properties and reliability of NCF flip-chip-on-organic boards

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Issue Date
2005-12-11
Language
ENG
Citation

International Symposium on Electronics Materials and Packaging, 2005, v.2005, pp.156 - 161

URI
http://hdl.handle.net/10203/138560
Appears in Collection
MS-Conference Papers(학술회의논문)
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