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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

Effects of the functional groups of non-conductive films (NCFs) on materials properties and reliability of NCF flip-chip-on-organic boards

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dc.contributor.authorChung, CK-
dc.contributor.authorKwon, WS-
dc.contributor.authorPark, JH-
dc.contributor.authorLee, Soon-Bok-
dc.contributor.authorPaik, Kyung-Wook-
dc.date.accessioned2013-03-17T01:53:48Z-
dc.date.available2013-03-17T01:53:48Z-
dc.date.created2012-02-06-
dc.date.issued2005-12-11-
dc.identifier.citationInternational Symposium on Electronics Materials and Packaging, 2005, v.2005, no., pp.156 - 161-
dc.identifier.urihttp://hdl.handle.net/10203/138560-
dc.languageENG-
dc.titleEffects of the functional groups of non-conductive films (NCFs) on materials properties and reliability of NCF flip-chip-on-organic boards-
dc.typeConference-
dc.identifier.scopusid2-s2.0-33847334704-
dc.type.rimsCONF-
dc.citation.volume2005-
dc.citation.beginningpage156-
dc.citation.endingpage161-
dc.citation.publicationnameInternational Symposium on Electronics Materials and Packaging, 2005-
dc.identifier.conferencecountryJapan-
dc.identifier.conferencecountryJapan-
dc.contributor.localauthorLee, Soon-Bok-
dc.contributor.localauthorPaik, Kyung-Wook-
dc.contributor.nonIdAuthorChung, CK-
dc.contributor.nonIdAuthorKwon, WS-
dc.contributor.nonIdAuthorPark, JH-
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MS-Conference Papers(학술회의논문)
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