Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Author Jeon, YD
Showing results 11 to 16 of 16
| Reduced thermal strain in flip chip assembly on organic substrate using low cte anisotropie conductive film Yim, MJ; Jeon, YD; Paik, Kyung-Wook, IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING , v.23, no.3, pp.171 - 176, 2000-07 |
| Solder reflow process induced residual warpage measurement and its influence on reliability of flip-chip electronic packages Yang, SY; Jeon, YD; Lee, Soon-Bok; Paik, Kyung-Wook, MICROELECTRONICS RELIABILITY, v.46, pp.512 - 522, 2006-02 |
| Stresses in electroless Ni-P films for electronic packaging applications Jeon, YD; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.25, no.1, pp.169 - 173, 2002-03 |
| Studies of electroless nickel under bump metallurgy-solder interfacial reactions and their effects on flip chip solder joint reliability Jeon, YD; Paik, Kyung-Wook; Bok, KS; Choi, WS; Cho, CL, JOURNAL OF ELECTRONIC MATERIALS, v.31, no.5, pp.520 - 528, 2002-05 |
| Studies on Ni-Sn intermetallic compound and P-rich Ni layer at the electroless Nickel UBM - Solder interface and their effects on flip chip solder joint reliability Jeon, YD; Paik, Kyung-Wook; Bok, KS; Choi, WS; Cho, CL, 51st Electronic Components and Technology Conference, pp.1326 - 1332, IEEE, 2001-05-29 |
| Studies on the interfacial reactions between electroless Ni UBM and 95.5Sn-4.0 Ag-0.5 Cu alloy Jeon, YD; Nieland, S; Ostmann, A; Reichl, H; Paik, Kyung-Wook, 52nd Electronic Components and Technology Conference, pp.740 - 746, IEEE, 2002-05-28 |
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