Showing results 1 to 10 of 10
A Novel Double Layer NCF for Highly Reliable Micro-Bump Interconnection Shin, Ji-Won; Choi, Yong-Won; Kim, Young Soon; Kang, Un Byung; Seo, Sun Kyung; Paik, Kyung-Wook, The 64th Electronic Components and Technology Conference, The 64th Electronic Components and Technology Conference, 2014-05-28 |
A Novel Fine Pitch TSV Interconnection Method Using NCF with Zn Nano -particles Shin, Ji-Won; Choi, Yong-Won; Kim, Young Soon; Kang, Un Byung; Seo, Sun Kyung; Paik, Kyung-Wook, The 64th Electronic Components and Technology Conference, The 64th Electronic Components and Technology Conference, 2014-05-28 |
A Study on the Fine Pitch Chip Interconnection Using Cu/SnAg Bumps and B-stage Non-conductive Films (NCFs) for 3D-TSV Vertical Interconnection Choi, Yong-Won; Shin, Ji-Won; Kim, Young Soon; Suk, Kyung-lim; Kim, Il; Paik, Kyung-Wook, The 64th Electronic Components and Technology Conference, The 64th Electronic Components and Technology Conference, 2014-05-28 |
(A) study on interfacial reactions of Pd added ultra-fine Au bonding wires and Al pads = 팔라듐이 첨가된 초 미세직경 금 본딩 와이어와 알루미늄 패드의 계면 반응에 대한 연구link Shin, Ji-Won; 신지원; et al, 한국과학기술원, 2010 |
Development of Anhydride-based NCFs for Cu/Sn-Ag Eutectic Bonding and Process Optimization for Fine Pitch TSV Chip Stacking Shin, Ji-Won; Choi, Yong-Won; Kim, Young Soon; Kang, Un Byung; Jee, Young Kun; Hwang, Ji Hwan; Paik, Kyung-Wook, The 62nd Electronic Components and Technology Conference, IEEE, 2012-05 |
Effect of NCFs with Zn-nanoparticles on the Interfacial Reactions of 40 um Pitch Cu pillar/Sn-Ag Bump for TSV Interconnection Shin, Ji-Won; Choi, Yong-Won; Kim, Young Soon; Kim, Un Byung; Jee, Young Kun; Paik, Kyung-Wook, The 63rd Electronic Components and Technology Conference, pp.1024 - 1030, The 63rd Electronic Components and Technology Conference, 2013-05-30 |
Effects of Pad Surface Finish on Interfacial Reliabilities of Cu-Pillar/Sn-Ag Bumps of 2.5D TSV-Enterposer on PCB Applications Kim, Young Soon; Shin, Ji-Won; Choi, Yong-Won; Paik, Kyung-Wook, The 64th Electronic Components and Technology Conference, The 64th Electronic Components and Technology Conference, 2014-05-28 |
Effects of Thermo-compression Bonding Parameters on Joint Formation of Micro-bumps in Non-conductive Film (NCF) Shin, Ji-Won; Kim, Young Soon; Lee, Hyoung Gi; Kang, Un Byung; Seo, Sun Kyung; Paik, Kyung-Wook, 65th Electronic Components and Technology Conference, IEEE Electronic Components and Technology Conference, 2015-05-28 |
Fine pitch chip on board (CoB) bonding using B-stage non-conductive film (NCF) for 3D TSV vertical interconnection Choi, Yongwon; Shin, Ji-Won; Kim, Il; Kim, Young-soon; Paik, Kyung-Wook, 15th IEEE International Symposium and Exhibition on Advanced Packaging Materials (APM 2013) , pp.186 - 191, 15th IEEE International Symposium and Exhibition on Advanced Packaging Materials (APM 2013), 2013-02-27 |
Reliability Improvement Methods of Solder Anisotropic Conductive Film (ACF) Joints Using Morphology Control of Solder ACF Joints Kim, Yoo-Sun; Kim, Seung-Ho; Shin, Ji-Won; Paik, Kyung-Wook, The 64th Electronic Components and Technology Conference, The 64th Electronic Components and Technology Conference, 2014-05-29 |
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