Browse "Dept. of Mechanical Engineering(기계공학과)" by Author 668
Showing results 121 to 177 of 177
| Positive energy method in life prediction of gray cast iron and spheroidal cast iron at elevated temperatures Lee, Soon-Bok; Lee, KO, Fatigue Damage of Structural Materials VII, 2008 |
| Prediction of Thermomechanical Behavior of the AISI316L Stainless Steel Yoon, S; Hong, SG; Lee, Soon-Bok, ASTM Thermomechancal Fatigue Behavior of Materials, pp.16 - 17, 2001 |
| Profiles of self stress and load stress at notches Fuchs, HO; Lee, Soon-Bok, Fatigue '87, pp.1009 - 1018, 1987 |
| Random Thermomechanical Fatigue Deformations Analysis Lee, Keum-Oh; Lee, Soon-Bok, International Conference on Fatigue Damage of Structural Materials, 2006 |
| Rayleigh Wave Transmission Characteristics of Continuous Caasting Slab for Medium Carbon Steel Lee, Soon-Bok; Lee, Jun-Youn, KAIST-Tokyo Tech Joint Workshop, 2004 |
| Real-time reliability monitoring system in electronic package by using interferometric moire Park, Jin-Hyoung; Lee, Soon-Bok, 2006 KSME Spring Conference, 2006-06 |
| Reliability and failure analysis of lead-free solder joints for PBGA package under a cyclic bending load Kim, I; Lee, Soon-Bok, IEEE Transactions on Components and Packaging Technologies, pp.478 - 484, 2005 |
| Reliability Assessment of Advanced Electronics Packaging and MEMS(Key-Note Speech) Lee, Soon-Bok, Tokyo Tech-KAIST joint workshop, pp.3 - 4, 2005 |
| Reliability assessment of advanced materials and structures Lee, Soon-Bok, APCMM09, 2009-11 |
| Reliability assessment of BGA solder joints under cyclic bending loads Kim, Ilho; Lee, Soon-Bok, EMAP 2005: 2005 International Symposium on Electronics Materials and Packaging, v.2005, pp.27 - 32, 2005-12-11 |
| Reliability Assessment of Electronic Packaging and Thin Film Lee Soon-Bok, ICMR2011(International Conference on Materials Reliability 2011), KSME, 2011-11 |
| Reliability Assessment of Electronic Packaging with Hybrid Approach of Experimental and Computational Mechanics Lee, Soon-Bok; Kim, Ilho, APCOM'07 in conjunction with EPMESC XI, 2011-08-12 |
| Reliability Assessment of Electronics Packaging and Thin Films for Flexible Electronics Lee, Soon-Bok, 2014 International Conference on Quality, Reliability, Risk, Maintenance, and Safety Engineering(QR2MSE 2014), Quality, Reliability, Risk, Maintenance, and Safety Engineering(QR2MSE 2014), 2014-07-22 |
| Reliability Assessment of Electronics Packaging with Fringe Pattern Analysis Lee, Soon-Bok; Ham, Suk-Jin, ICEM05, pp.17 -, 2005 |
| RELIABILITY ASSESSMENT OF LEAD-FREE SOLDER JOINTS IN ELECTRONICS PACKAGING Lee, Soon-Bok, UKC 2008, 2008 |
| Reliability Assessments of Flip Chip Solder Joints with experimental and Numerical Methods Lee, Soon-Bok; Ham, SJ, Workshop on Flip Chip Packaging, 1999 |
| Reliability Assessments of Lead-contained and Lead-free BGA Solder Joints under Cyclic Bending Loads Kim, IH; Lee, Soon-Bok, 대한기계학회 신뢰성부문 및 한국신뢰성학회 공동학술대회, pp.64 - 71, 2006 |
| Reliability evaluation of CIF (chip-in-flex) and COF (chip-on-flex) packages Jang, JW; Suk, KL; Paik, KW; Lee, Soon-Bok, 4th International Conference on Experimental Mechanics, pp.119 -, 2009-11-18 |
| Reliability Evaluation of Solder joints in Electronics Packaging Lee, Soon-Bok, Korea-Usa Electronic Packaging Symposium, pp.110 - 129, 2002 |
| Simulation of Fatigue-Creep Damage of Type 304 Stainless Steel at Elevated Temperature Lee, Soon-Bok; Woo, YS; Kim, JY, Fatigue '93, pp.927 - 932, 1993 |
| Strength evaluation of excavator components for integrity under fatigue loading confitions Lee, Soon-Bok; Lee, SH, Fatigue '90, pp.2123 - 2128, 1990 |
| Stress profiles at notches for fatigue strength improvements Lee, Soon-Bok, Asian-Pacific Congress of Strength Evaluation '89, (APCS'89), pp.611 - 616, 1989 |
| Stretchability of silver nanoparticle thin film on polymer substrate for printed electronics applications Won, Sejeon; Kim, Sanghyeok; Sim, Gi-Dong; Park, Inkyu; Hong, Seong-Gu; Lee, Soon-Bok, 2012년도 신뢰성부문 춘계학술대회, pp.176 - 177, KSME(대한기계학회) 신뢰성부문, 2012-04 |
| Stretchability of Silver Thin Film Deposited on Polymer Substrate under Electrical Current Condition Jang, Dong Won; Hong, Seong Gu; Lee, Soon Bok, ICMR2015, International Conference on Materials and Reliability, 2015-11-23 |
| Structural Fatigue test of Automobile Components under constant amplitude loading Lee, Soon-Bok, Proc. of ASM Fatigue, Fracture, Failure Analysis Symposium, pp.177 - 186, 1985 |
| Structural fatigue testing of the lower body frame of an excavator Lee, Soon-Bok; Joo, Ch; Lee, SH, Proceedings of the 1991 SEM Spring Conference on Experimental Mechanics, 1991 |
| Studies on the thermal cycling reliability of fine pitch Cu/SnAg double-bump flip chip assemblies on organic substrates: Experimental results and numerical analysis Son, HY; Paik, KW; Kim, I; Park, JH; Lee, Soon-Bok; Jung, GJ; Park, BJ; et al, 10th Electronics Packaging Technology Conference, EPTC 2008, pp.716 - 724, 2008-12-09 |
| The development of a Creep-fatigue life prediction model of type 316L stainless steels Lee, Soon-Bok, ATEM'03, 2003 |
| The Effect of Creep Damage on the Fracture Toughness of 304 Stainless Steel Lee, Soon-Bok; Kim, JY; Koh, YH, 1995 SEM SPring Conference on Experimental Mechanics, pp.63 - 70, 1995 |
| The effect of pre-strain on the low cycle fatigue behavior of 316L stainless steel at elevated temperature Hong, Seong-Gu; Yoon, Samson; Lee, Soon-Bok, Int. Conference on Fatigue Damage of Structural Materials, 2002 |
| The effect of pre-straining on the low cycle fatigue behavior of 316L stainless steel at elevated emperature Lee, Soon-Bok, Int conf on Fatigue Damage of Materials-Experiment and Analysis, 2003-01-01 |
| The effect of temperature on low-cycle fatigue behavior of prior cold worked 316L stainless steel Hong, SG; Yoon, S; Lee, Soon-Bok, International Conference on Fatigue Damage of Structural Mater, v.25, no.40797, pp.1293 - 1300, 2002-09-22 |
| The Effect of Thickness on Thermal Properties and Behavior of Submicron Copper Film on Polymer Substrate Lee, Soon-Bok; Yoon, Ji-Young; Kim, Sung-Yeol, Tokyo Tech-KAIST joint workshop, pp.82 - 84, 2005 |
| The effects of microstructure on material behaviors of solder alloys Lee, Soon-Bok; Hwang, Tae-kyung, APCFS(Asian Pacific Conf for Fracture and Strength)'04, pp.88 - 88, 2004 |
| The ettect of pre-strain on the low cycle fatigue behavior of 316L stainless steel at elevated temparature Lee, Soon-Bok, Conference on Fatigue Damage of Structural Materials, 2002 |
| The fatigue life of a water-cooled stator bar of power plants subjected to the electrical degradations Hong, SK; Kim, JH; Lee, Soon-Bok; Kim, YW; Bae, YC; Kim, HS; Lee, H, KSME 2000 Conference of Materials and Fracture, pp.234 - 238, 2001 |
| The Influence of Microstructure Change on Thermal Fatigue Life of Solder Ball Lee, Soon-Bok; Ryu, Jong-Eun; Hwang, TK, Tokyo Tech-KAIST joint workshop, pp.52 - 53, 2005 |
| The Measurement of Mechanical Properties for Nickel Thin Film Park, TS; Baek, DC; Lee, Soon-Bok; Na, KH, Workshop on Development of Micro Optical and Thermofluidic Devices with Functionality, pp.73 - 78, 2002 |
| The viscoelastic behavior of 316 Stainless steel under creep dominant, thermomechanical loading between 400C and 600C Youn, Samson; Hong, SG; Lee, Soon-Bok, Asian Pacific Conference for Fracture and Strength'99, APCFS'99, pp.CD - ROM, 1999 |
| Thermal crack initiation mechanism at high alloy steel slab with phase transformation Lee, Yong Seok; Kim, Seong-Woo; Lee, Soon-Bok, Fatigue 2014 (11th International fatigue congress), Fatigue 2014, 2014-03-04 |
| Thermal crack initiation of high alloy steel slab after continuous casting process through finite element analysis Lee, Yong Seok; Kim, Seong Woo; Lee, You Ho; Lee, Soon Bok, Asian Conference on Experimental Mechanics(ACEM) 2016, KSME Materials and Fracture Division / Reliability Division, 2016-11-16 |
| Thermal Cycling Reliability Issue of Thick Cu Column Based Cu/SnAg Double-Bump Flip Chip Assemblies on Organic Substrates for Fine Pitch Applications Lee, Soon-Bok; Son, HY; Kim, I; Park, JH; Jung, GJ; Park, BJ; Byun, KY; et al, EPTC 2008, 2008 |
| Thermal cycling reliability of Cu/SnAg double-bump flip-chip assemblies for 100um pitch applications Son, HY; Kim, IH; Lee, Soon-Bok; Jung, GJ; Park, BJ; Paik, KW, International Conference on Electronic Materials and Packaging 2007, EMAP 2007, 2007-11-19 |
| Thermal loading measurement and thermal fatigue test for solder bumps in electronncs packaging Park, TS; Lee, Soon-Bok, KSME 99 Conference of Materials and Fracture Division, KSME 99MF27, pp.55 - 60, 1999 |
| Thermo-Mechanical Reliability Assessment of Thin Electronic Packages with High Density Interconnects using Moire Methods Lee, Soon-Bok, SEM Fall Conference 2014, SEM Fall Conference 2014, 2014-10-21 |
| Thermomechanical fatigue behavior of ferritic stainless steel Lee, Soon-Bok; Lee, Keum-Oh; Hong, Seong-Gu; Yoon, Samson; Kim, Bong-Soo, APCFS(Asian Pacific Conf for Fracture and Strength)'04, pp.190 - 190, 2004 |
| Thermomechanical Fatigue Deformation Approach Using Bi-Linear Model Lee, Soon-Bok; Lee, Keum-Oh, Tokyo Tech-KAIST joint workshop, pp.38 - 39, 2005 |
| Thermomechanical Fatigue of the Ferritic Stainless Steel 429EM Lee, Soon-Bok; Lee, Keum-oh; Yoon, Samson, FEOFS 2003, 2003 |
| Warpage behavior of chip-on-flex(COF) package under thermal cycling condition Jang, Jae-Won; Suk, Kyoung-Lim; Paik, Kyung-Wook; Lee, Soon-Bok, Int conf. on Computer-aided Manufacturing and Design, CMD2010, 2010-11 |
| 무연소더와 유연소더의 피로 수명비교연구 이순복; 김일호; 박태상, IMAPS-Korea 추계 기술 심포지움, pp.49 - 49, 2004 |
| 미세구조가 BGA소더 조인트의 열적 피로특성에 미치는 영향, 06RE018 류종은; 황태경; 이순복, 대한기계학회 신뢰성부문 및 한국신뢰성학회 공동학술대회, pp.106 - 111, 2006 |
| 미소 영역의 변형량 측정을 위한 고분해능 원자 현미경 모아레 기법 박진형; 이순복, 대한기계학회 2006년도 추계학술대회, 2006-11 |
| 미소전자패키징의 신뢰성 평가 이순복, KSME 신뢰성부문 2011년도 춘계학술대회, 대한기계학회, 2011-05-19 |
| 소더 Reflow시 발생하는 잔류 휨 양상의 측정과 플립칩 전자 패키지의 신뢰성에 미치는 영향 이순복; 양세영; 전영두, IMPAS-Korea 추계 기술심포지움, pp.15 - 15, 2004 |
| 열하중과 굽힘하중조건에서의 솔더조인트의 피로 특성비교연구 이순복; 김일호, 한국신뢰성학회, 기계학회 신뢰성부문 공동학술대회, 2007 |
| 인쇄회로기판용 구리 박막의 다양한 환경 하에서의 기계적 거동 평가 이용석; 하상렬; 이순복, 대한기계학회 창립 70주년 기념 학술대회, 대한기계학회, 2015-11-13 |
| 코인드 소더 범프의 수치해석 황태경; 나재웅; 백경욱; 이순복, 대한기계학회 학술대회, pp.0 - 0, 대한기계학회, 2002-03 |
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