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College of Engineering(공과대학)School of Mechanical and Aerospace Engineering(기계항공공학부)Dept. of Mechanical Engineering(기계공학과)ME-Conference Papers(학술회의논문)

소더 Reflow시 발생하는 잔류 휨 양상의 측정과 플립칩 전자 패키지의 신뢰성에 미치는 영향

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이순복researcher / 양세영 / 전영두
Issue Date
2004
Language
KOR
Citation

IMPAS-Korea 추계 기술심포지움, pp.15 - 15

URI
http://hdl.handle.net/10203/150377
Appears in Collection
ME-Conference Papers(학술회의논문)
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