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College of Engineering(공과대학)School of Mechanical and Aerospace Engineering(기계항공공학부)Dept. of Mechanical Engineering(기계공학과)ME-Conference Papers(학술회의논문)

The Effect of Thickness on Thermal Properties and Behavior of Submicron Copper Film on Polymer Substrate

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Lee, Soon-Bokresearcher / Yoon, Ji-Young / Kim, Sung-Yeol
Issue Date
2005
Language
ENG
Citation

Tokyo Tech-KAIST joint workshop, pp.82 - 84

URI
http://hdl.handle.net/10203/142075
Appears in Collection
ME-Conference Papers(학술회의논문)
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