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Showing results 44461 to 44480 of 279143
| Chip-based microenzyme assay for kinase using antibody Lee, SangYup, Center for Ultramicrochemical Process Systems Workshop, Center for Ultramicrochemical Process Systems Workshop, 2003-01-17 |
| Chip-based protease assay using fluorescence resonance energy transfer between quantum dots and fluorophores Kim, Young Pil; Oh, Young-Hee; Oh, Eunkeu; Kim, Hak-Sung, BIOCHIP JOURNAL, v.1, no.4, pp.228 - 233, 2007-12 |
| Chip-in packaging technology using aluminum substrate (pocket embedded packaging) = 알루미늄 기판을 이용한 Chip-In Packaging 기술link Kim, Kyoung-Min; 김경민; et al, 한국과학기술원, 2008 |
| Chip-level 2-D RAKE receiver with symbol-level searcher beamforming Chang K.H.; Sohn I.S.; Chang K.S., IEEE VTS 50th Vehicular Technology Conference, VTC 1999-Fall, v.50, pp.924 - 928, 1999-09-19 |
| Chip-Level Simultaneous Switching Current Measurement in Power Distribution Network Using Magnetically Coupled Embedded Current Probing Structure Kim, Jonghoon J.; Cho, Changhyun; Bae, Bumhee; Kim, Suk Jin; Kong, Sunkyu; Kim, Hee-Gon; Jung, Daniel Hyunsuk; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.4, no.12, pp.1963 - 1972, 2014-12 |
| Chip-level Wireless Power Transfer Scheme Design for Next Generation Wireless Interconnected Three-Dimensional Integrated Circuits Song, Jinwook; Jung, Seungtaek; Park, Shinyoung; Kim, Jonghoon; Hong, Seokwoo; Kim, Joungho, IEEE Wireless Power Transfer Conference (WPTC), IEEE Wireless Power Transfer Conference 2017, 2017-05-10 |
| Chip-level wireless power transfer scheme design using magnetic-field resonant coupling for next generation wireless interconnected 3-D IC = 차세대 무선 삼차원 반도체를 위한 자기장 공명 기술을 이용한 칩-단위 무선 전력 전송 도식 설계link Song, Jinwook; Kim, Joung Ho; et al, 한국과학기술원, 2018 |
| Chip-package co-design of power distribution network for system-in-package applications Kim, G.; Kam, D.G.; Chung, D.; Kim, Joungho, 6th Electronics Packaging Technology Conference, EPTC 2004, pp.499 - 501, IEEE, 2005-12-08 |
| Chip-package co-modeling & verification of noise coupling & generation in CMOS DC/DC buck converter Song, T.; Kim, J.; Pak, J.; Kim, Joungho, 20th International Zurich Symposium on Electromagnetic Compatibility, EMC Zurich 2009, pp.285 - 288, IEEE, 2009-01-12 |
| Chip-Package Hierarchical Power Distribution Network Modeling and Analysis Based on a Segmentation Method Kim, Jae-Min; Lee, Woo-Jin; Shim, Yu-Jeong; Shim, Jong-Joo; Kim, Ki-Yeong; Pak, Jun-So; Kim, Joung-Ho, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.33, no.3, pp.647 - 659, 2010-08 |
| Chip-package hybrid clock distribution network and DLL for low jitter clock delivery Daehyun Chung; Chunghyun Ryu; Hyungsoo Kim; Choonheung Lee; Jinhan Kim; Kicheol Bae; Jiheon Yu; et al, IEEE JOURNAL OF SOLID-STATE CIRCUITS, v.41, no.1, pp.274 - 286, 2006-01 |
| Chip-Package Hybrid Clock Distribution Network and DLL for Low Jitter Clock Delivery Chung, Daehyun; Ryu, Chunghyun; Kim, Hyungsoo; Lee, Choonheung; Kim, Jinhan; Bae, Kicheol; Yu, Jiheon; et al, Solid-state circuits, IEEE Journal of, vol.41. pp. 274-286, 2006-01 |
| Chip-Package-Circuit Co-modeling for Analysis of Digital Power and Ground Noise Coupling Effect on CMOS Negative Feedback Operational Amplifier Kim, Joungho; Shim, Yujeong; Park, Jongbae, EMC compo, 2007 |
| Chip-scale high-speed Fourier-transform spectrometer based on a combination of a Michelson and a Fabry-Perot interferometer Yu, Kyoungsik; Park, N.; Lee, D.; Solgaard, O., Proceedings of IEEE Sensors, art. v.0, no.0, pp.412 - 415, IEEE, 2006 |
| Chip-scale power booster for light Kim, Jungwon, SCIENCE, v.376, no.6599, pp.1269 - 1269, 2022-06 |
| Chip-scale wavelength standards(*) Bopp, Douglas G.; Hummon, Matthew T.; Kang, Songbai; Kitching, John; Li, Qing; Westly, Daron A.; Kim, Sangsik; et al, 7th International School of Physics "Enrico Fermi" on New Frontiers for Metrology: From Biology and Chemistry to Quantum and Data Science, pp.443 - 449, IOS Press BV, 2019-07 |
| Chip-to-chip interconnection by mechanical caulking using reflowed Sn bumps Yang, JH; Kim, YH; Moon, JS; Lee, Won-Jong, 2007 8th International Conference on Electronic Packaging Technology, ICEPT, 2007-08-14 |
| CHIP-TO-CHIP INTERFACE USING MICROSTRIP CIRCUIT AND DIELECTRIC WAVEGUIDE Bae, Hyeon-Min; Song, Ha Il; Jin, Huxian |
| CHIP-TO-CHIP INTERFACE USING MICROSTRIP CIRCUIT AND DIELECTRIC WAVEGUIDE Bae, Hyeon-Min; Song, Ha Il; JIN HUXIAN |
| CHIP-TO-CHIP INTERFACE USING MICROSTRIP CIRCUIT AND DIELECTRIC WAVEGUIDE Bae, Hyeon-Min; Song, Ha Il; JIN HUXIAN |
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