Chip-package co-modeling & verification of noise coupling & generation in CMOS DC/DC buck converter

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Publisher
IEEE
Issue Date
2009-01-12
Language
ENG
Citation

20th International Zurich Symposium on Electromagnetic Compatibility, EMC Zurich 2009, pp.285 - 288

URI
http://hdl.handle.net/10203/20034
Appears in Collection
EE-Conference Papers(학술회의논문)
Files in This Item
[Pub] Chip-Package Co-modeling & Verification of Noise Coupling & Generation in CMOS DCDC Buck Converter.pdf(3.29 MB)Download

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