The Effect of Anisotropic Conductive Films Adhesion on the Bending Reliability of Chip-in-Flex Packages for Wearable Electronics Applications

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Publisher
Electronic Components and Technology Conference
Issue Date
2016-06-01
Language
English
Citation

66th Electronic Components and Technology Conference, pp.1583 - 1591

URI
http://hdl.handle.net/10203/216397
Appears in Collection
ME-Conference Papers(학술회의논문)MS-Conference Papers(학술회의논문)
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