The Effect of Anisotropic Conductive Films Adhesion on the Bending Reliability of Chip-in-Flex Packages for Wearable Electronics Applications
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Kim, Ji Hye | ko |
| dc.contributor.author | Lee, Tae Ik | ko |
| dc.contributor.author | Kim, Taek Soo | ko |
| dc.contributor.author | Paik, Kyung Wook | ko |
| dc.date.accessioned | 2017-01-10T02:07:30Z | - |
| dc.date.available | 2017-01-10T02:07:30Z | - |
| dc.date.created | 2016-12-16 | - |
| dc.date.issued | 2016-06-01 | - |
| dc.identifier.citation | 66th Electronic Components and Technology Conference, pp.1583 - 1591 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/216397 | - |
| dc.language | English | - |
| dc.publisher | Electronic Components and Technology Conference | - |
| dc.title | The Effect of Anisotropic Conductive Films Adhesion on the Bending Reliability of Chip-in-Flex Packages for Wearable Electronics Applications | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 1583 | - |
| dc.citation.endingpage | 1591 | - |
| dc.citation.publicationname | 66th Electronic Components and Technology Conference | - |
| dc.identifier.conferencecountry | US | - |
| dc.identifier.conferencelocation | Cosmopolitan Hotel of Las Vegas | - |
| dc.contributor.localauthor | Kim, Taek Soo | - |
| dc.contributor.localauthor | Paik, Kyung Wook | - |
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