Showing results 37201 to 37220 of 51621
Thermal annealing chracteristics of amorphous silicon-based solar cells incorporating stable protocrystalline silicon and unstable microcrystalline silicon at the onset of a microcrystalline regime Ahn, J.Y.; Jun, K.H.; Konagai, M.; Lim, Koeng Su, Proceddings of the 3rd World Conference on Photovoltaic Energy Conversion, pp.1741 - 1744, 2003-05-11 |
Thermal Annealing 효과에 의한 다층박막 FBAR 소자의 공진특성개선 윤기완; 김동현; 임문혁; Linh, Mai, 한국해양정보통신학회추계학술대회, pp.633 - 636, 한국해양정보통신학회, 2003-10 |
Thermal Characterics of Long-Period Grating in Silicon Optical Waveguide Cho, YB; Yang, BK; Shin, Sang Yung, Asia-Pacific Optical Communications, 2006 |
Thermal characteristics of InGaP/GaAs HBT ballasted with extended ledge Jeon, S; Park, HM; Hong, Songcheol, IEEE TRANSACTIONS ON ELECTRON DEVICES, v.48, no.10, pp.2442 - 2445, 2001-10 |
Thermal characteristics of long-period gratings in silicon optical waveguide Cho, Y.B.; Yang, B.K.; Shin, Sang Yung, Passive Components and Fiber-based Devices III, v.6351 I, 2006-09-05 |
Thermal Conductivity and Thermal Boundary Resistances of ALD Al2O3 Films on Si and Sapphire Lee, Seung-Min; Choi, Won Chul; Kim, Junsoo; Kim, Taekwang; Lee, Jaewoo; Im, Sol Yee; Kwon, Jung Yoon; et al, INTERNATIONAL JOURNAL OF THERMOPHYSICS, v.38, no.176, 2017-12 |
Thermal conductivity measurement of silicon/silicide laminated structures by 3w method Choi, Won Cheol; Kim, Jun Soo; Kim, Soo Jeong; Kim, Tae Kwang; Jung, Heun Dal; Jung, Tae Hyung; Nam, Eun Soo; et al, 2015 European Materials Research Society (EMRS) Spring Meeting, EMRS, 2015-05-14 |
Thermal conductivity of ultrathin Si films with a periodic pore pattern Oh, Jung Hyun; Choi, Won Chul; Jang, Moon Kyu; Shin, Mincheol, 17th International Workshop on Computational Electronics, IWCE 2014, 2014-06-06 |
Thermal diffusion barrier metallization based on Co-Mo powder-mixed composites for n-type skutterudite ((Mm,Sm)(y)Co4Sb12) thermoelectric devices Song, Jinseop; Kim, Yeongseon; Cho, Byung Jin; Yoo, Chung-Yul; Yoon, Hana; Park, Sang Hyun, JOURNAL OF ALLOYS AND COMPOUNDS, v.818, 2020-03 |
Thermal display glove for interacting with virtual reality Kim, Seung-Won; Kim, Sung Hee; Kim, Choong Sun; Yi, Kyoungsoo; Kim, Jun-Sik; Cho, Byung Jin; Cha, Youngsu, SCIENTIFIC REPORTS, v.10, no.1, 2020-07 |
Thermal effect analysis on crosstalk and performance of optoelectronic transmitter modules for optical interconnects Ukaegbu, Ikechi Augustine; Uddin, M. Rakib; Sangirov, Jamshid; Nguyen, Nga T. H.; Lee, Tae-Woo; Cho, Mu Hee; Park, Hyo-Hoon, OPTICAL AND QUANTUM ELECTRONICS, v.49, no.8, 2017-08 |
Thermal effects on interconnect crosstalk of optoelectronic transmitter modules Ukaegbu, Ikechi Augustine; Sangirov, Jamshid; Nakarmi, Bikash; Lee, Tae Woo; Cho, Mu Hee; Park, HyoHoon, SPIE/COS Photonics Asia 2012, The International Society for Optical Engineering, Chinese Optical Society, 2012-11-07 |
Thermal Effects on Through-Silicon-Via (TSV) Signal Integrity Lee, Manho; Cho, Jonghyun; Pak, Jun So; Lee, Hyungdong; Kim, Joungho, 62nd Electronic Components and Technology Conference (ECTC), 62nd Electronic Components and Technology Conference (ECTC), 2012-05-29 |
Thermal hardware-based data security device that permanently erases data by using local heat generation phenomenon and method thereof Choi, Yang-Kyu; Park, Jun-Young |
Thermal image enhancement using convolutional neural network Choi, Yukyung; Kim, Namil; Hwang, Soonmin; Kweon, In-So, IEEE/RSJ International Conference on Intelligent Robots and Systems (IROS 2016), IEEE Robotics and Automation Society (RAS), 2016-10-11 |
Thermal imaging applications using polydiacetylene supramolecules = Polydiacetylene Supramolecule 를 이용한 열적 구동 이미징 시스템의 응용link Yarimaga, Oktay; Choi, Yang-Kyu; et al, 한국과학기술원, 2010 |
Thermal Improvement for 2.75 GHz-FBAR Devices Yoon, Giwan; Linh, Mai; Lee, Jae-young; Pham, Van-Su; Kabir, S. M. Humayun; Dang, Hoai-Bac, 한국해양정보통신학회 추계종합학술대회 , pp.196 - 199, 한국해양정보통신학회, 2007-10 |
Thermal instability of effective work function in metal/high-kappa stack and its material dependence Joo, MS; Cho, Byung Jin; Balasubramanian, N; Kwong, DL, IEEE ELECTRON DEVICE LETTERS, v.25, no.11, pp.716 - 718, 2004-11 |
Thermal issues in 3D IC 신인섭; 김상민; 백승훈; 서문준; 유리은; 신영수, 전자공학회지, v.36, no.9, pp.980 - 990, 2009-09 |
Thermal issues in 3D IC 신인섭; 김상민; 백승훈; 서문준; 유리은; 신영수, 3차원반도체집적기술 특집, 전자공학회지, 2009-09 |
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