Thermal effect analysis on crosstalk and performance of optoelectronic transmitter modules for optical interconnects

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This paper presents thermal analysis on crosstalk and performance of optoelectronic transmitter modules and also demonstrates the thermal analysis for efficient heat dissipation for the transmitter modules. The thermal crosstalk model for analysis is based on interconnects parameters for vertically stacked and horizontally packaged optoelectronic transmitter modules. While the analytical expression is used to estimate the thermal critical frequency, fcrit_th, above which signals become severely deteriorated, a fcrit_thermal printed circuit board (PCB) has been designed for packaging the optoelectronic transmitter modules to ensure efficient heat dissipation. The thermal and performance analysis of the packaged modules show that the chips operate at temperatures below the fcrit_th, which is apt for reliable data and signal transmission.
Publisher
SPRINGER
Issue Date
2017-08
Language
English
Article Type
Article
Citation

OPTICAL AND QUANTUM ELECTRONICS, v.49, no.8

ISSN
0306-8919
DOI
10.1007/s11082-017-1110-8
URI
http://hdl.handle.net/10203/225474
Appears in Collection
EE-Journal Papers(저널논문)
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