Browse "School of Electrical Engineering(전기및전자공학부)" by Title
Showing results 25541 to 25560 of 51050
| Modeling Acoustic Transitions in Speech by Modified Hidden Markov Models with State Duration and State Duration and State Duration-Dependent Observation Probabilities j. h. lee; c. k. un, JOURNAL OF LIGHTWAVE TECHNOLOGY, 1996-07 |
| Modeling Analysis and Control of Static Var Compensator Using Three-Level Inverter Cho, Gyu-Hyeong, IEEE IAS Rec, pp.837 - 843, IEEE, 1992-10 |
| Modeling and analysis for the coexistence of PSC I and PSC II in the IEEE 802.16e system Kwon, Sang Wook; Cho, Dong-Ho, 2010 IEEE 21st International Symposium on Personal Indoor and Mobile Radio Communications, PIMRC 2010, pp.1487 - 1492, IEEE, 2010-09-26 |
| Modeling and analysis of 3D-power distribution network (3D-PDN) in TSV-based 3D-IC based on a segmentation method = 구조 분할 방법에 기반한 관통 실리콘 비아 기반 3차원 IC 내 3차원 전력 분배망의 모델링 및 분석link Kim, Ki-Yeong; 김기영; et al, 한국과학기술원, 2011 |
| Modeling and analysis of 3D-power distribution network (3D-PDN) in TSV-based 3D-IC based on a segmentation method = 구조 분할 방법에 기반한 관통 실리콘 비아 기반 3차원 IC 내 3차원 전력 분배망의 모델링 및 분석link Kim, Ki-Yeong; 김기영; et al, 한국과학기술원, 2011 |
| Modeling and analysis of a conductive rubber contactor for package test Kim, Hyesoo; Bae, Bumhee; Kim, Jonghoon J; Park, Junyong; Ha, Dongho; Bae, Michael; Kim, Joungho, 17th IEEE Electronics Packaging and Technology Conference, EPTC 2015, Institute of Electrical and Electronics Engineers Inc., 2015-12 |
| MODELING AND ANALYSIS OF A NONLINEAR ELASTOMER IMPACT MODEL WITH A DAMPING MECHANISM Sung, Dan Keun, IEICE TRANSACTIONS ON FUNDAMENTALS OF ELECTRONICS COMMUNICATIONS AND COMPUTER SCIENCES, v.E75A, no.8, pp.1020 - 1025, 1992-08 |
| Modeling and Analysis of a Nonlinear Elastomer Impact Model with Damping Mechanism Sung, Dan Keun, IECON, pp.609 - 612, 1991 |
| Modeling and Analysis of a Power Distribution Network in TSV-Based 3-D Memory IC Including P/G TSVs, On-Chip Decoupling Capacitors, and Silicon Substrate Effects Kim, Ki-Yeong; Hwang, Chul-Soon; Koo, Kyoung-Choul; Cho, Jong-Hyun; Kim, Hee-Gon; Kim, Joung-Ho; Lee, Jun-Ho; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.2, no.12, pp.2057 - 2070, 2012-12 |
| Modeling and analysis of a static var compensator using multilevel voltage source inverter Choi, Nam S.; Cho, Guk C.; Cho, Gyu-Hyeong, Proceedings of the 28th Annual Meeting of the IEEE Industry Applications Conference, v.2, pp.901 - 908, 1993-10-03 |
| Modeling and Analysis of a Tandom Link Connection under the Burst-Error Condition Y.J.Cho; C.K.Un, IEEE TRANSACTIONS ON COMMUNICATIONS, v.42, no.2, pp.360 - 366, 1994-02 |
Modeling and Analysis of an Energy-Efficient Mobility Management Scheme in IP-Based Wireless Networks Hwang, Ho Young; Kwon, Sun-Jong; Chung, Yun Won; Sung, Dan Keun; Park, Suwon, SENSORS, v.11, no.12, pp.11273 - 11294, 2011-12 |
| Modeling and analysis of an energy-efficient sleep-mode operation in IEEE 802.16e system Chu,EM; Jung, BH; Sung, Dan Keun; Park, YJ, IEEE ICC 2012, IEEE, 2012-06 |
| Modeling and analysis of Buck-type three phase PWM rectifier by circuit DQ transformation Han, Soo-Bin; Choi, Nam-Sup; Rim, Chuntaek; Cho, Gyu-Hyeong, Power Electronics Specialists Conference, 1995. PESC '95 Record., 26th Annual IEEE, pp.431 - 436, IEEE, 1995-06 |
| Modeling and Analysis of CDMA Soft Handoff Sung, Dan Keun; Park, S; Cho, HS, IEEE Vehicular Technology Conference, pp.1525 - 1529, 1996 |
| Modeling and analysis of chip-package-pcb hierarchical power distribution network based on segmentation method = 구조 분할 방법에 기반한 칩-패키지-보드 계층적 전력분배망의 모델링 및 분석link Kim, Jae-Min; 김재민; et al, 한국과학기술원, 2010 |
| Modeling and analysis of combined mobility management based on implicit cell update scheme in general packet radio service Chung, Y.W.; Sung, Dan Keun, 57th IEEE Semiannual Vehicular Technology Conference (VTC2003), v.57, no.1, pp.160 - 164, 2003-04-22 |
| Modeling and analysis of coupling between TSVs, metal, and RDL interconnects in TSV-based 3D IC with silicon interposer Yoon, K.; Kim, G.; Lee, W.; Song, T.; Lee, J.; Lee, H.; Park, K.; et al, 2009 11th Electronic Packaging Technology Conference, EPTC 2009, pp.702 - 706, 2009-12-09 |
| Modeling and Analysis of Defects in Through Silicon Via Channel for Non-invasive Fault Isolation Kim, Joungho; Kim, Heegon; Kim, Jonghoon J; Kim, Sukjin; Bae, Hyun-Cheol; Choi, Kwang-Seong, IEEE International 3D Systems Integration Conference (3DIC), IEEE International 3D Systems Integration Conference (3DIC), 2015-08-31 |
| Modeling and analysis of Die-to-Die vertical coupling and RF sensitivity degradation in 3-D IC = 집적화된 3차원 IC에서의 층간 수직 커플링 현상 분석 및 모델링과 RF 신호 민감성 저하에 대한 연구link Lee, Sang-Rok; 이상록; et al, 한국과학기술원, 2010 |
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