Modeling and analysis of coupling between TSVs, metal, and RDL interconnects in TSV-based 3D IC with silicon interposer
- Issue Date
- 2009-12-09
- Language
- ENG
- Citation
2009 11th Electronic Packaging Technology Conference, EPTC 2009, pp.702 - 706
- Appears in Collection
- EE-Conference Papers(학술회의논문)
- Files in This Item
- There are no files associated with this item.
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