Experimental and Numerical Approaches for Reliability Evaluation of Electronic Packaging

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There are two major methods, experimental and numerical approaches, for dealing with the strain and stress analysis essential to reliability assessment of electronic packaging. Both approaches are mutually complementary in view point of their assessment capability. In this paper, experimental and numerical simulation results for analyzing some reliability issues of electronic packages were reviewed, and the role of both approaches were discussed.
Publisher
Japan Society of Mechanical Engineers
Issue Date
2013-06
Language
English
Citation

Journal of Computational Science and Technology, v.7, no.2, pp.265 - 277

ISSN
1881-6894
URI
http://hdl.handle.net/10203/174412
Appears in Collection
ME-Journal Papers(저널논문)
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