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College of Engineering(공과대학)School of Mechanical and Aerospace Engineering(기계항공공학부)Dept. of Mechanical Engineering(기계공학과)ME-Journal Papers(저널논문)

Experimental and Numerical Approaches for Reliability Evaluation of Electronic Packaging

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dc.contributor.authorLee, Soon-Bokko
dc.contributor.authorJANG, Jae-Wonko
dc.date.accessioned2013-08-08T05:10:49Z-
dc.date.available2013-08-08T05:10:49Z-
dc.date.created2013-07-26-
dc.date.created2013-07-26-
dc.date.issued2013-06-
dc.identifier.citationJournal of Computational Science and Technology, v.7, no.2, pp.265 - 277-
dc.identifier.issn1881-6894-
dc.identifier.urihttp://hdl.handle.net/10203/174412-
dc.description.abstractThere are two major methods, experimental and numerical approaches, for dealing with the strain and stress analysis essential to reliability assessment of electronic packaging. Both approaches are mutually complementary in view point of their assessment capability. In this paper, experimental and numerical simulation results for analyzing some reliability issues of electronic packages were reviewed, and the role of both approaches were discussed.-
dc.languageEnglish-
dc.publisherJapan Society of Mechanical Engineers-
dc.titleExperimental and Numerical Approaches for Reliability Evaluation of Electronic Packaging-
dc.typeArticle-
dc.type.rimsART-
dc.citation.volume7-
dc.citation.issue2-
dc.citation.beginningpage265-
dc.citation.endingpage277-
dc.citation.publicationnameJournal of Computational Science and Technology-
dc.contributor.localauthorLee, Soon-Bok-
dc.contributor.nonIdAuthorJANG, Jae-Won-
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ME-Journal Papers(저널논문)
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