Reduced Temperature Coefficient of Capacitance (TCC) of Embedded Capacitor Films (ECFs) for Organic Substrates using SrTiO3 and Multifunctional Epoxy

Abstract

Epoxy/ceramic composites have attracted great interest as embedded capacitor materials, mainly due to the process compatibility of epoxy with printed circuit boards (PCBs). However, one of the potential problems of epoxy/ceramic composites is the temperature dependence of their dielectric properties. This study focuses mainly on reducing the temperature coefficient of capacitance (TCC) of epoxy/ceramic composites using multifunctional epoxy and SrTiO3 powder. The TCC of an epoxy/ceramic composite mainly depends on the properties of its epoxy and ceramic powder. Using multifunctional epoxy, the epoxy resin showed two glass-transition temperatures, resulting in a lower dimensional change after the first glass-transition temperature. Additionally, the TCC of epoxy/SrTiO3 ECFs can be decreased by increasing the SrTiO3 powder content. As a result, reduced TCC of epoxy/ceramic composite capacitors using a multifunctional epoxy and SrTiO3 powder was successfully demonstrated for embedded capacitors in organic substrates.